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/images/com-hpc/som-com-hpc-a-dragonwing-iq9-front.jpg

SOM-COM-HPC-A-Dragonwing-IQ10

COM-HPC® 1.3 Client Size A module based on Qualcomm Dragonwing™ IQ10 Series, with up to 700 TOPS of AI Acceleration.

Compact Vision 5 Dragonwing IQ-2390

Compact Vision 5 Dragonwing IQ-2390

5.0" HMI based on Qualcomm Dragonwing™ IQ-2390 Processors

SBC-Dragonwing-IQ-2390

SBC-Dragonwing-IQ-2390

Compact SBC based on Qualcomm Dragonwing™ IQ-2390 Processors

SOM-COMe-CT6-Dragonwing-IQ9

SOM-COMe-CT6-Dragonwing-IQ9

COM Express® 3.1 Type 6 Compact Module with Qualcomm Dragonwing™ IQ9 Processors. (F99)

/images/smarc/SOM-SMARC-IQ8_image.jpg

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.2 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

Processore Qualcomm

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Opzioni
Cpu Power Consumption
  1. range 10-25 W 1 elemento
  2. range < 10 W 1 elemento
  3. range < 5 W 2 elementi
  4. range > 25 W 1 elemento
Cpu Type
  1. NXP i.MX 93 1 elemento
  2. Qualcomm Snapdragon 1 elemento
  3. Qualcomm® QCS5430 1 elemento
  4. Qualcomm® QCS6490 4 elementi
  5. Qualcomm Dragonwing IQ-2390 1 elemento
  6. Qualcomm Dragonwing IQ-X 1 elemento
  7. Qualcomm Dragonwing IQ9 1 elemento
  8. Qualcomm® Dragonwing IQ-8 1 elemento
Ethernet
  1. ETHERNET≥1 8 elementi
  2. ETHERNET≥2 7 elementi
Form Factor
  1. COM Express® 2 elementi
  2. COM-HPC® 1 elemento
  3. Myon MicroModule SOM 1 elemento
  4. SMARC 4 elementi
  5. Boxed Solutions 1 elemento
  6. Modular HMIs 2 elementi
  7. Single Board Computer 2 elementi
Form Factor Dimensions
  1. 48,5 x 32,5 mm 1 elemento
  2. ≤ 100 x 100mm 3 elementi
  3. ≥ 100 x 100mm 2 elementi
  4. COM Express® 2 elementi
Form Factor Specification
  1. COM Express Compact 1 elemento
Memory
  1. memory ≤1 3 elementi
  2. memory ≤2 3 elementi
  3. memory ≤4 5 elementi
  4. memory ≤8 2 elementi
  5. soldered down 7 elementi
  6. memory ≤32 1 elemento
  7. UFS 3.1 module on-board 1 elemento
  8. I2C EEPROM 2 elementi
  9. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 elemento
Mounting Option
  1. VESA Mount 2 elementi
  2. Rear Mount 2 elementi
  3. Panel Mount 2 elementi
  4. Flush Mount 2 elementi
Mass Storage
  1. soldered down 1 elemento
  2. I2C EEPROM 1 elemento
  3. M.2 NVMe SSD slot 1 elemento
  4. microSD card slot 2 elementi
  5. onboard eMMC 7 elementi
  6. onboard eMMC 2 elementi
  7. SATA channels ≥ 2 1 elemento
  8. SD interface 5 elementi
  9. SD interface 1 elemento
  10. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 elemento
  11. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 elementi
Operating Temperature
  1. -20°C ÷ +60°C 3 elementi
  2. -40°C ÷ +85°C 4 elementi
  3. 0°C ÷ +50°C 3 elementi
  4. 0°C ÷ +60°C 11 elementi
  5. 20°C ÷ +70°C 2 elementi
  6. -20°C ÷ +70°C 2 elementi
  7. -40°C ÷ +60°C 1 elemento
Pci Express
  1. PCI-e lanes ≥ 1 2 elementi
  2. PCI-e lanes ≥ 2 2 elementi
  3. PCI-e lanes ≥ 4 1 elemento
  4. PCI-e lanes ≥ 5 2 elementi
Ttl Uarts
  1. TTL Uarts ≥1 4 elementi
  2. TTL Uarts ≥2 4 elementi
  3. TTL Uarts ≥3 2 elementi
USB
  1. USB 2.0 ≥ 1 5 elementi
  2. USB 2.0 ≥ 2 2 elementi
  3. USB 2.0 ≥ 3 2 elementi
  4. USB 2.0 ≥ 4 3 elementi
  5. USB 2.0 ≥ 5 1 elemento
  6. USB 2.0 ≥ 6 1 elemento
  7. USB 3.0 ≥ 1 1 elemento
  8. USB 3.0 ≥ 2 1 elemento
  9. USB 3.0 ≥ 4 1 elemento
  10. USB 3.1 ≥ 1 4 elementi
  11. USB 3.2 ≥ 1 2 elementi
  12. USB CLIENT 2 elementi
  13. USB OTG 1 elemento
Video Interfaces
  1. DDI 1 elemento
  2. DP 6 elementi
  3. DUAL CHANNEL LVDS 4 elementi
  4. eDP 4 elementi
  5. HDMI 1 elemento
  6. MIPI-CSI camera conn 4 elementi
  7. MIPI-DSI 6 elementi
  8. SINGLE CHANNEL LVDS 3 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 elementi
  2. ONBOARD WI-FI/BLE 4 elementi
  3. /s/n/snapdragon-x_per_sito.jpg 1 elemento