Menu
Account
Processore Qualcomm

Ultimi prodotti

/images/smarc/smarc-iq8-fake.jpg

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm® IQ8 Applications Processors

/images/fanless-pc/modular-link-iq-615-front.jpg

Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 processor

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 processor

Processore Qualcomm

Naviga per
Cancella tutto

3 elementi

Imposta la direzione decrescente
per pagina
Naviga per
Filtri attivi
  1. Operating Temperature
    0°C ÷ +50°C
Cancella tutto
Opzioni
Cpu Type
  1. Qualcomm® QCS5430 1 elemento
  2. Qualcomm® QCS6490 1 elemento
  3. Qualcomm Dragonwing IQ-X 1 elemento
Ethernet
  1. ETHERNET≥1 2 elementi
  2. ETHERNET≥2 3 elementi
Form Factor
  1. COM Express® 1 elemento
  2. SMARC 2 elementi
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 elementi
  2. COM Express® 1 elemento
Memory
  1. memory ≤1 2 elementi
  2. memory ≤2 2 elementi
  3. memory ≤4 2 elementi
  4. memory ≤8 2 elementi
  5. soldered down 2 elementi
  6. I2C EEPROM 1 elemento
  7. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 elemento
Mass Storage
  1. I2C EEPROM 1 elemento
  2. onboard eMMC 1 elemento
  3. onboard eMMC 1 elemento
  4. SD interface 1 elemento
  5. SD interface 1 elemento
  6. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 3 elementi
  2. -40°C ÷ +85°C 3 elementi
  3. 0°C ÷ +50°C 3 elementi
  4. 0°C ÷ +60°C 7 elementi
  5. 20°C ÷ +70°C 2 elementi
  6. -20°C ÷ +70°C 2 elementi
Pci Express
  1. PCI-e lanes ≥ 1 2 elementi
  2. PCI-e lanes ≥ 2 2 elementi
Ttl Uarts
  1. TTL Uarts ≥1 2 elementi
  2. TTL Uarts ≥2 2 elementi
USB
  1. USB 2.0 ≥ 1 2 elementi
  2. USB 2.0 ≥ 2 2 elementi
  3. USB 2.0 ≥ 3 2 elementi
  4. USB 2.0 ≥ 4 2 elementi
  5. USB 3.1 ≥ 1 2 elementi
Video Interfaces
  1. DP 2 elementi
  2. DUAL CHANNEL LVDS 2 elementi
  3. eDP 2 elementi
  4. MIPI-CSI camera conn 1 elemento
  5. MIPI-DSI 2 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 elementi
  2. /s/n/snapdragon-x_per_sito.jpg 1 elemento