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Processore Intel

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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Computer embedded senza ventola con processori Intel® Core™ di 11a generazione e Intel® Celeron® SoCs (Codename: Tiger Lake UP3). Dotato di un chip Axelera AI: alimentato da un singolo Metis AIPU fino a 120 TOPS

Processore Intel

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  1. Memory
    memory ≥32
  2. Mass Storage
    onboard eMMC
  3. Operating Temperature
    0°C ÷ +60°C
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Opzioni
Cpu Type
  1. Intel® Atom™ 1 elemento
  2. Intel® Celeron® 1 elemento
  3. Intel® Core™ 1 elemento
  4. Intel® Pentium® 1 elemento
Ethernet
  1. ETHERNET≥1 1 elemento
  2. ETHERNET≥2 1 elemento
Form Factor
  1. COM Express® 1 elemento
  2. SMARC 1 elemento
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 elemento
  2. ≤ 80 x 80mm 1 elemento
Form Factor Specification
  1. COM Express Compact 1 elemento
Memory
  1. memory ≤1 13 elementi
  2. memory ≤16 8 elementi
  3. memory ≤2 13 elementi
  4. memory ≤4 13 elementi
  5. memory ≤8 13 elementi
  6. memory ≥32 2 elementi
  7. soldered down 10 elementi
  8. SO_DIMM 5 elementi
Mass Storage
  1. CFAST slot 1 elemento
  2. M.2 NVMe SSD slot 4 elementi
  3. M.2 SATA SSD slot 6 elementi
  4. onboard eMMC 2 elementi
  5. SATA channels ≥ 1 10 elementi
  6. SATA channels ≥ 2 1 elemento
  7. SATA channels ≥ 2 1 elemento
  8. SATA channels ≥ 2 10 elementi
  9. SATA channels ≥ 3 5 elementi
  10. SATA channels ≥ 4 4 elementi
  11. SD interface 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 1 elemento
  2. -20°C ÷ +70°C 1 elemento
  3. -40°C ÷ +85°C 1 elemento
  4. 0°C ÷ +50°C 1 elemento
  5. 0°C ÷ +60°C 2 elementi
  6. 20°C ÷ +70°C 1 elemento
Pci Express
  1. PCI-e lanes ≥ 1 1 elemento
  2. PCI-e lanes ≥ 2 1 elemento
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 2 elementi
  5. PCI-e lanes ≥ 5 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 1 elemento
  2. TTL Uarts ≥2 1 elemento
USB
  1. USB 2.0 ≥ 1 1 elemento
  2. USB 2.0 ≥ 2 1 elemento
  3. USB 2.0 ≥ 3 1 elemento
  4. USB 2.0 ≥ 4 1 elemento
  5. USB 2.0 ≥ 5 1 elemento
  6. USB 2.0 ≥ 6 2 elementi
  7. USB 3.2 ≥ 1 1 elemento
  8. USB 3.2 ≥ 2 1 elemento
Video Interfaces
  1. DDI 1 elemento
  2. DP++ 1 elemento
  3. DUAL CHANNEL LVDS 1 elemento
  4. eDP 2 elementi
  5. MIPI-CSI camera conn 1 elemento
  6. SINGLE CHANNEL LVDS 1 elemento