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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Computer embedded senza ventola con processori Intel® Core™ di 11a generazione e Intel® Celeron® SoCs (Codename: Tiger Lake UP3). Dotato di un chip Axelera AI: alimentato da un singolo Metis AIPU fino a 120 TOPS

Processore Intel

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  1. Form Factor Dimensions
    ≤ 100 x 100mm
  2. Memory
    memory ≤2
  3. Mass Storage
    microSD card slot
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Opzioni
Cpu Power Consumption
  1. range 10-25 W 2 elementi
  2. range < 10 W 1 elemento
Cpu Type
  1. Intel® Atom™ 1 elemento
  2. Intel® Celeron® 2 elementi
  3. Intel® Core™ 1 elemento
  4. Intel® Pentium® 1 elemento
Ethernet
  1. ETHERNET≥1 2 elementi
  2. ETHERNET≥2 1 elemento
Form Factor
  1. COM Express® 1 elemento
  2. Single Board Computer 1 elemento
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 elementi
  2. ≥ 100 x 100mm 1 elemento
Form Factor Specification
  1. COM Express Compact 1 elemento
  2. Pico-ITX 1 elemento
Memory
  1. memory ≤1 1 elemento
  2. memory ≤16 1 elemento
  3. memory ≤2 2 elementi
  4. memory ≤4 2 elementi
  5. memory ≤8 3 elementi
  6. memory ≥32 1 elemento
  7. soldered down 2 elementi
  8. SO_DIMM 1 elemento
Mass Storage
  1. onboard SSD 1 elemento
  2. standard SATA connector 1 elemento
  3. M.2 SATA SSD slot 2 elementi
  4. microSD card slot 2 elementi
  5. onboard eMMC 10 elementi
  6. SATA channels ≥ 1 11 elementi
  7. SATA channels ≥ 2 7 elementi
  8. SATA channels ≥ 3 1 elemento
  9. SD interface 2 elementi
Operating Temperature
  1. -20°C ÷ +60°C 1 elemento
  2. -40°C ÷ +85°C 1 elemento
  3. 0°C ÷ +50°C 1 elemento
  4. 0°C ÷ +60°C 1 elemento
  5. 20°C ÷ +70°C 1 elemento
Pci Express
  1. PCI-e lanes ≥ 1 1 elemento
  2. PCI-e lanes ≥ 2 1 elemento
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 1 elemento
  5. PCI-e lanes ≥ 5 1 elemento
USB
  1. USB 2.0 ≥ 1 2 elementi
  2. USB 2.0 ≥ 2 1 elemento
  3. USB 2.0 ≥ 3 1 elemento
  4. USB 2.0 ≥ 4 1 elemento
  5. USB 2.0 ≥ 5 1 elemento
  6. USB 2.0 ≥ 6 1 elemento
  7. USB 3.0 ≥ 1 1 elemento
  8. USB 3.0 ≥ 2 1 elemento
  9. USB 3.1 ≥ 1 1 elemento
  10. USB 3.1 ≥ 2 1 elemento
Video Interfaces
  1. DDI 1 elemento
  2. DP 1 elemento
  3. DP++ 1 elemento
  4. DUAL CHANNEL LVDS 2 elementi
  5. eDP 1 elemento
  6. HDMI 2 elementi
  7. SINGLE CHANNEL LVDS 2 elementi
  8. VGA 1 elemento
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 elemento
  2. M.2 Socket 2 key B 1 elemento