Menu
Account
Processore Intel

Ultimi prodotti

/images/fanless-pc/palladio-500-rpl-ai-main.jpg

Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Computer embedded senza ventola con processori Intel® Core™ di 11a generazione e Intel® Celeron® SoCs (Codename: Tiger Lake UP3). Dotato di un chip Axelera AI: alimentato da un singolo Metis AIPU fino a 120 TOPS

Processore Intel

Naviga per
Cancella tutto
Naviga per
Filtri attivi
  1. Form Factor
    Boxed Solutions
  2. Mass Storage
    onboard SSD
  3. USB
    USB 2.0 ≥ 2
Cancella tutto
Opzioni
Cpu Power Consumption
  1. range 10-25 W 1 elemento
  2. range < 10 W 1 elemento
Ethernet
  1. ETHERNET≥1 1 elemento
  2. ETHERNET≥2 1 elemento
Form Factor
  1. Boxed Solutions 1 elemento
  2. Single Board Computer 1 elemento
Memory
  1. memory ≤1 1 elemento
  2. memory ≤2 1 elemento
  3. memory ≤4 1 elemento
  4. memory ≤8 1 elemento
  5. soldered down 1 elemento
Mass Storage
  1. onboard SSD 1 elemento
  2. M.2 SATA SSD slot 1 elemento
  3. onboard eMMC 2 elementi
  4. SATA channels ≥ 1 2 elementi
Operating Temperature
  1. 0°C ÷ +50°C 1 elemento
  2. 0°C ÷ +60°C 1 elemento
USB
  1. USB 2.0 ≥ 1 1 elemento
  2. USB 2.0 ≥ 2 1 elemento
  3. USB 3.0 ≥ 1 1 elemento
  4. USB 3.0 ≥ 2 1 elemento
Video Interfaces
  1. DP 1 elemento
  2. DP++ 1 elemento
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 elemento
  2. M.2 SOCKET 2 KEY 1 elemento
  3. M.2 Socket 2 key B 1 elemento