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Computer on Module
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SOM-COMe-BT6-PTLCOM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)x86 COM Express® Processore Intel AI-Optimized Hardware -
SOM-COM-HPC-A-TGL-HComputer on Module (CoM) COM-HPC® Client Size A con processori Intel® Xeon® di undicesima generazione W-11000E Series Core™ vPro® e Celeron® (Codename: Tiger Lake H) per applicazioni FuSa. (LAGOON - D57)x86 COM-HPC® Processore Intel AI-Optimized Hardware -
SOM-COMe-CT6-Dragonwing-IQ-XCOM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)Arm COM Express® Processore Qualcomm -
SOM-Trizeps-X-Genio360SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)Arm Trizeps SODIMM (SOM) Processore Mediatek -
SOM-COMe-CT6-P100COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series. (F45)COM Express® -
SOM-COMe-CT6-R8000COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ Embedded 8000 Series. (F07)COM Express® Processore AMD