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Computer on Module
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SOM-COM-HPC-A-TGL-HComputer on Module (CoM) COM-HPC® Client Size A con processori Intel® Xeon® di undicesima generazione W-11000E Series Core™ vPro® e Celeron® (Codename: Tiger Lake H) per applicazioni FuSa. (LAGOON - D57)x86 COM-HPC® Processore Intel AI-Optimized Hardware -
SOM-COMe-CT6-Dragonwing-IQ-XCOM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)Arm COM Express® Processore Qualcomm -
SOM-COMe-CT6-P100COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series. (F45)COM Express® -
SOM-COMe-CT6-R8000COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ Embedded 8000 Series. (F07)COM Express® Processore AMD -
SOM-COMe-CT6-TWLCOM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)x86 COM Express® Processore Intel -
SOM-COMe-CT6-ASLCOM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000RE Series (Codename: Amston Lake). (E90)x86 COM Express® Processore Intel