SOM-COM-HPC-A-TGL-H

Computer on Module (CoM) COM-HPC® Client Size A con processori Intel® Xeon® di undicesima generazione W-11000E Series Core™ vPro® e Celeron® (Codename: Tiger Lake H) per applicazioni FuSa. (LAGOON - D57)

Disponibile nell'intervallo di temperatura industriale

Data sheet

Wiki

Configurazioni

Contattaci per maggiori informazioni e per preventivi

Contattaci

Cpu

11th Gen Intel® Xeon®, Core™ and Celeron® processors

Grafica

Intel® Iris Xe Graphics Core Gen12 GPU with up to 32 EU, up to 4 independent displays

Connettività

2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; up to 2x 2.5GbE

Memoria

Two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory

Dettagli Prodotto

Informazioni tecniche

Descrizione	Computer on Module (CoM) COM-HPC® Client Size A con processori Intel® Xeon® di undicesima generazione W-11000E Series Core™ vPro® e Celeron® (precedentemente noti come Tiger Lake H) per applicazioni FuSa
Cpu	11th Generation Intel® Xeon®, Core™ and Celeron® Processors, also available in industrial temperature range. • Intel® Core™ vPRO® i7-11850HE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB Cache L3, 45/35W cTDP • Intel® Core™ vPRO® i5-11500HE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, 45/35W cTDP • Intel® Core™ i3-11100HE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, 45/35W cTDP • Intel® Celeron® 6600HE, Dual Core @2.6GHz, 8MB L3 Cache, 35W TDP • Intel® Xeon® vPRO® W-11865MRE, Eight Core @ 2.6GHz (up to 4.7GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF) • Intel® Xeon® vPRO® W-11555MRE, Six Core @ 2.6GHz (up to 4.5GHz in Turbo Boost) with HT, 12MB L3 Cache, with ECC, TCC/TSN and Functional Safety Essential Design package, 45/35W cTDP – Industrial (w/ Turbo OFF) • Intel® Xeon® W-11155MRE, Quad Core @ 2.4GHz (up to 4.4GHz in Turbo Boost) with HT, 8MB L3 Cache, with ECC and TCC/TSN, 45/35W cTDP – Industrial (w/ Turbo OFF) • Intel® Xeon® vPRO® W-11865MLE, Eight Core @ 1.5GHz (up to 4.5GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP • Intel® Xeon® vPRO® W-11555MLE, Six Core @ 1.9GHz (up to 4.4GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP • Intel® Xeon® W-11155MLE, Quad Core @ 1.8GHz (up to 3.1GHz in Turbo Boost) with HT, 24MB L3 Cache, with ECC and TCC/TSN, 25W TDP B Cache, 28/15/12W cTDP - Industrial (w/ Turbo OFF)
Numero Max Core	8
Memoria	2x DDR4-3200 SODIMM Slots with ECC (In-Band Error Correction Code), up to 64GB supported
Grafica	Integrated Iris Xe Graphics Core Gen12 architecture, with up to 32 Execution Units and up to 2 VDbox MPEG2, WMV9, AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP9, AV1 HW decoding, up to 8k60. AVC/H.264, HEVC/H.265, JPEG, VP9 HW encoding, up to 8k30 Support up to 4 independent displays.
Interfacce video	1x eDP 1.4b or MIPI_DSI 1.3 Up to 3x DP++ interface, supporting Display Port 1.4a and HDMI 2.0b Up to 2x Display Port over Type-C (Alternate mode)
Risoluzione video	DP, eDP: Up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC MIPI-DSI: Up to 3200x2000 @60Hz 24bpp, 5120x3200 @60Hz 24bpp with DSC HDMI 1.4: Up to 4Kx2K 24-30Hz 24bpp HDMI 2.0b: Up to 4Kx2K 48-60Hz 24bpp / 4Kx2K 48- 60Hz 12bpc (need dedicated redriver on carrier board)
Memoria di massa	2 x S-ATA Gen3 Channels PCI-e x4 port can be used to connect, on the carrier board, M.2 NVMe drives
Rete	Up to 2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 2.5GbE Controllers with TSN
USB	2x USB4 ports 2x USB 3.2 Gen 2x2 ports 8 x USB 2.0 Host ports
Pci	1x PCI-e x4 Gen 4 port for NVME 16x PCI-e Gen4 lanes, can be used to support 1x PCI-e x16, 2x PCI-e x8 or (1x PCI-e x8 +2x PCI-e x4) root ports 20x PCI-e Gen 3 lanes, groupable to support up to 12 root ports, max allowed grouping PCI-e x4
Audio	SoundWire and I2S Audio Interface
Porte seriali	2x legacy UARTs, managed by the Embedded Controller
Altre interfacce	2x 4-lane CSI-2 interfaces, optional SPI, eSPI, SM Bus, 2x I2C, Watchdog timer, Carrier board FAN Control Management signals, ACPI signals, Safety Status signals Deep Sleep / Battery support Optional TPM 2.0 module on-board 12x GPIOs
Dispositivo di alimentazione	+8VDC .. +20VDC Main power supply +5V stand-by
Sistema operativo	Windows 10 IoT Enterprise LTSC Linux Kernel LTS Yocto Project 3.0 WindRiver VxWorks 7.0 Android
Temperatura operativa	0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial Range)
Dimensioni	120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)

Software

Link	SECO Technical Resources

Documentazione

Data Sheet	[Datasheet] SOM-COM-HPC-A-TGL-H Rel. 1.0
Image	[Picture] LAGOON_front [Picture] LAGOON_back

Part Number

Elementi prodotti raggruppati
HD57-4100-0120-C1	Descrizione Part Number COM HPC Client Size A w/ Intel® Tiger Lake H 6600H, PCH-H 500 HM570E , 4wire FAN, TPM SLB 9670 Q2.0 - Comm. Temp.	Contattaci
HD57-5300-0120-I1	Descrizione Part Number COM HPC Client Size A w/ Intel® Tiger Lake H W-11865MRE, PCH-H 500 RM590E , 4wire FAN, TPM SLB 9670 Q2.0 - Ind. Temp.	Contattaci
HD57-6300-0120-I1	Descrizione Part Number COM HPC Client Size A w/ Intel® Tiger Lake H W-11555MRE, PCH-H 500 RM590E , 4wire FAN, TPM SLB 9670 Q2.0 - Ind. Temp.	Contattaci