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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

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SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

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Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Computer embedded senza ventola basato sul processore Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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2 elementi

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Filtri attivi
  1. Form Factor Dimensions
    ≤ 100 x 100mm
  2. USB
    USB 2.0 ≥ 5
  3. Video Interfaces
    HDMI
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Opzioni
Cpu Maker
  1. MediaTek 1 elemento
  2. NXP 1 elemento
Cpu Power Consumption
  1. range < 10 W 1 elemento
Cpu Type
  1. MediaTek Genio 510 1 elemento
  2. NXP i.MX 8M 1 elemento
Form Factor
  1. Qseven 1 elemento
  2. SMARC 1 elemento
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 elementi
  2. ≤ 80 x 80mm 1 elemento
  3. ≥ 100 x 100mm 1 elemento
Form Factor Specification
  1. Qseven 70x70 mm 1 elemento
Memory
  1. memory ≤1 2 elementi
  2. memory ≤2 2 elementi
  3. memory ≤4 2 elementi
  4. memory ≤8 1 elemento
  5. soldered down 2 elementi
Mass Storage
  1. microSD card slot 1 elemento
  2. onboard eMMC 2 elementi
Operating Temperature
  1. -20°C ÷ +60°C 2 elementi
  2. -20°C ÷ +70°C 1 elemento
  3. -40°C ÷ +85°C 2 elementi
  4. 0°C ÷ +50°C 2 elementi
  5. 0°C ÷ +60°C 2 elementi
  6. 20°C ÷ +70°C 2 elementi
Pci Express
  1. PCI-e lanes ≥ 1 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 2 elementi
  2. TTL Uarts ≥2 2 elementi
  3. TTL Uarts ≥3 1 elemento
USB
  1. USB 2.0 ≥ 1 7 elementi
  2. USB 2.0 ≥ 2 7 elementi
  3. USB 2.0 ≥ 3 5 elementi
  4. USB 2.0 ≥ 4 4 elementi
  5. USB 2.0 ≥ 5 2 elementi
  6. USB 2.0 ≥ 6 1 elemento
  7. USB 3.0 ≥ 1 5 elementi
  8. USB 3.0 ≥ 2 3 elementi
  9. USB 3.0 ≥ 4 1 elemento
  10. USB 3.1 ≥ 1 1 elemento
  11. USB OTG 5 elementi
Video Interfaces
  1. DP 3 elementi
  2. DUAL CHANNEL LVDS 4 elementi
  3. eDP 3 elementi
  4. HDMI 2 elementi
  5. MIPI-CSI camera conn 1 elemento
  6. MIPI-DSI 1 elemento
  7. SINGLE CHANNEL LVDS 3 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 elemento
  2. ONBOARD WI-FI/BLE 1 elemento