Menu
Account
Arm

Ultimi prodotti

SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Computer embedded senza ventola basato sul processore Rockchip RK3399. (PICTOR - SYS-C31-IPC)

Arm

Naviga per
Cancella tutto

3 elementi

Imposta la direzione decrescente
per pagina
Naviga per
Filtri attivi
  1. Ethernet
    ETHERNET≥2
  2. Video Interfaces
    MIPI-CSI camera conn
Cancella tutto
Opzioni
Cpu Maker
  1. Arm System ready NXP 1 elemento
  2. Qualcomm 2 elementi
Cpu Power Consumption
  1. range < 10 W 1 elemento
Cpu Type
  1. NXP i.MX 8M Mini 1 elemento
  2. Qualcomm® QCS5430 1 elemento
  3. Qualcomm® Dragonwing IQ-8 1 elemento
Ethernet
  1. ETHERNET≥1 5 elementi
  2. ETHERNET≥2 3 elementi
Form Factor
  1. SMARC 2 elementi
  2. Single Board Computer 1 elemento
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 elementi
  2. ≥ 100 x 100mm 1 elemento
Form Factor Specification
  1. 3,5" 1 elemento
Memory
  1. memory ≤1 2 elementi
  2. memory ≤2 2 elementi
  3. memory ≤4 2 elementi
  4. memory ≤8 1 elemento
  5. soldered down 3 elementi
  6. memory ≤32 1 elemento
Mass Storage
  1. microSD card slot 1 elemento
  2. onboard eMMC 1 elemento
  3. onboard eMMC 1 elemento
  4. SD interface 2 elementi
  5. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 2 elementi
  2. -40°C ÷ +85°C 2 elementi
  3. 0°C ÷ +50°C 2 elementi
  4. 0°C ÷ +60°C 3 elementi
  5. 20°C ÷ +70°C 2 elementi
  6. -20°C ÷ +70°C 1 elemento
Pci Express
  1. PCI-e lanes ≥ 1 1 elemento
  2. PCI-e lanes ≥ 2 1 elemento
  3. PCI-e lanes ≥ 4 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 2 elementi
  2. TTL Uarts ≥2 2 elementi
  3. TTL Uarts ≥3 2 elementi
USB
  1. USB 2.0 ≥ 1 2 elementi
  2. USB 2.0 ≥ 2 2 elementi
  3. USB 2.0 ≥ 3 2 elementi
  4. USB 2.0 ≥ 4 2 elementi
  5. USB 2.0 ≥ 5 1 elemento
  6. USB 3.0 ≥ 2 1 elemento
  7. USB 3.1 ≥ 1 1 elemento
  8. USB OTG 1 elemento
Video Interfaces
  1. DP 5 elementi
  2. DUAL CHANNEL LVDS 12 elementi
  3. eDP 8 elementi
  4. HDMI 8 elementi
  5. MIPI-CSI camera conn 3 elementi
  6. MIPI-DSI 7 elementi
  7. PARALLEL RGB 2 elementi
  8. SINGLE CHANNEL LVDS 13 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 elemento
  2. ONBOARD WI-FI/BLE 1 elemento