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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Computer embedded senza ventola basato sul processore Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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  1. Ethernet
    ETHERNET≥2
  2. Operating Temperature
    0°C ÷ +60°C
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Opzioni
Cpu Maker
  1. AMD 1 elemento
  2. Arm System ready NXP 1 elemento
  3. NXP 7 elementi
  4. Qualcomm 4 elementi
  5. Rockchip 2 elementi
Cpu Power Consumption
  1. range 10-25 W 1 elemento
  2. range < 10 W 5 elementi
Cpu Type
  1. NXP i.MX 8M Mini 1 elemento
  2. NXP i.MX 8M Plus 1 elemento
  3. NXP i.MX 8X 2 elementi
  4. NXP i.MX 933/935 1 elemento
  5. NXP i.MX 95 1 elemento
  6. NXP i.MX6 1 elemento
  7. NXP i.MX8 1 elemento
  8. Qualcomm® QCS5430 1 elemento
  9. Qualcomm® QCS6490 1 elemento
  10. Rockchip RK3399 1 elemento
  11. Rockchip RK3568 1 elemento
  12. Zynq® Ultras 1 elemento
  13. Qualcomm Dragonwing IQ-X 1 elemento
  14. Qualcomm® Dragonwing IQ-8 1 elemento
Ethernet
  1. ETHERNET≥1 30 elementi
  2. ETHERNET≥2 15 elementi
Form Factor
  1. COM Express® 1 elemento
  2. SMARC 8 elementi
  3. Single Board Computer 6 elementi
Form Factor Dimensions
  1. ≤ 100 x 100mm 7 elementi
  2. ≤ 80 x 80mm 4 elementi
  3. ≥ 100 x 100mm 5 elementi
  4. COM Express® 1 elemento
Form Factor Specification
  1. 3,5" 5 elementi
  2. Other SBCs 1 elemento
Memory
  1. memory ≤1 12 elementi
  2. memory ≤16 1 elemento
  3. memory ≤2 12 elementi
  4. memory ≤4 11 elementi
  5. memory ≤8 5 elementi
  6. soldered down 12 elementi
  7. memory ≤32 1 elemento
  8. I2C EEPROM 1 elemento
  9. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 elemento
Mass Storage
  1. I2C EEPROM 1 elemento
  2. microSD card slot 4 elementi
  3. onboard eMMC 9 elementi
  4. onboard eMMC 4 elementi
  5. SATA channels ≥ 1 1 elemento
  6. SD interface 4 elementi
  7. SD interface 5 elementi
  8. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 elemento
  9. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 10 elementi
  2. -40°C ÷ +85°C 12 elementi
  3. 0°C ÷ +50°C 13 elementi
  4. 0°C ÷ +60°C 15 elementi
  5. 20°C ÷ +70°C 9 elementi
  6. -20°C ÷ +70°C 3 elementi
Pci Express
  1. PCI-e lanes ≥ 1 8 elementi
  2. PCI-e lanes ≥ 2 5 elementi
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 2 elementi
Ttl Uarts
  1. TTL Uarts ≥1 10 elementi
  2. TTL Uarts ≥2 9 elementi
  3. TTL Uarts ≥3 8 elementi
USB
  1. USB 2.0 ≥ 1 11 elementi
  2. USB 2.0 ≥ 2 11 elementi
  3. USB 2.0 ≥ 3 9 elementi
  4. USB 2.0 ≥ 4 7 elementi
  5. USB 2.0 ≥ 5 3 elementi
  6. USB 2.0 ≥ 6 1 elemento
  7. USB 3.0 ≥ 1 6 elementi
  8. USB 3.0 ≥ 2 5 elementi
  9. USB 3.1 ≥ 1 2 elementi
  10. USB OTG 8 elementi
Video Interfaces
  1. DP 5 elementi
  2. DUAL CHANNEL LVDS 12 elementi
  3. eDP 8 elementi
  4. HDMI 6 elementi
  5. MIPI-CSI camera conn 3 elementi
  6. MIPI-DSI 5 elementi
  7. SINGLE CHANNEL LVDS 11 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 5 elementi
  2. M.2 SOCKET 2 KEY 2 elementi
  3. ONBOARD WI-FI/BLE 7 elementi
  4. /s/n/snapdragon-x_per_sito.jpg 1 elemento