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SOM-SMARC-ADL-NComputer on Module (CoM) SMARC® Rel. 2.1.1 con processori Intel® Atom® serie x7000E, Intel® Core™ i3, Intel® Serie N (Codename: Alder Lake N). (FINLAY - E08)x86 Computer on Module SMARC® Processore Intel -
SBC-3.5-TGL-UP3SBC 3.5” con processori Intel® Core™ e Celeron® di undicesima generazione (codename: Tiger Lake-UP3). (PRISMA - D64)Processore Intel Single Board Computer 3.5-inch SBC -
SBC-3.5-RV1000SBC 3.5" con processore AMD Ryzen™ Embedded R1000/V1000. (MERIDA - C90)Single Board Computer 3.5-inch SBC -
HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - PackagedKit di sviluppo e accessori Accessori Dissipatori Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
DEV-KIT-COM-HPC-ACross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modulesKit di sviluppo e accessori Kit di sviluppo e kit di avvio COM-HPC Development Kit Dev Kits, Carrier Boards and Accessories Starter and Development Kits COM-HPC Development Kit -
Carrier-SMARC-2.0-B79Carrier board for SMARC rel. 2.0 / 2.1.1 compliant modules RB79Kit di sviluppo e accessori Scheda carrier Carrier Board per standard SMARC Dev Kits, Carrier Boards and Accessories Carrier Boards SMARC Carrier Boards