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  1. Operating Temperature
    20°C ÷ +70°C
  2. Wireless Connectivity
    M.2 SOCKET 1 KEY
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Opzioni
Cpu Maker
  1. AMD 1 elemento
  2. Intel 4 elementi
  3. MediaTek 1 elemento
  4. NXP 2 elementi
  5. Qualcomm 2 elementi
Cpu Power Consumption
  1. range 10-25 W 2 elementi
  2. range < 10 W 2 elementi
  3. range > 25 W 1 elemento
Cpu Type
  1. AMD Ryzen™ Embedded 1 elemento
  2. AMD® Ryzen™ embedded 1 elemento
  3. Intel® Atom™ 1 elemento
  4. Intel® Celeron® 1 elemento
  5. Intel® Core™ 3 elementi
  6. Intel® Pentium® 1 elemento
  7. MediaTek Genio 510 1 elemento
  8. NXP i.MX 95 1 elemento
  9. NXP i.MX8 1 elemento
  10. Qualcomm® QCS5430 1 elemento
  11. Qualcomm® QCS6490 1 elemento
Ethernet
  1. ETHERNET≥1 10 elementi
  2. ETHERNET≥2 9 elementi
Form Factor
  1. SMARC 4 elementi
  2. Boxed Solutions 3 elementi
  3. Single Board Computer 3 elementi
Form Factor Dimensions
  1. ≤ 100 x 100mm 5 elementi
  2. ≥ 100 x 100mm 2 elementi
Form Factor Specification
  1. 3,5" 2 elementi
  2. Pico-ITX 1 elemento
Memory
  1. memory ≤1 10 elementi
  2. memory ≤16 5 elementi
  3. memory ≤2 10 elementi
  4. memory ≤4 10 elementi
  5. memory ≤8 10 elementi
  6. memory ≥32 4 elementi
  7. soldered down 5 elementi
  8. SO_DIMM 4 elementi
Mass Storage
  1. onboard SSD 1 elemento
  2. M.2 NVMe SSD slot 1 elemento
  3. M.2 SATA SSD slot 4 elementi
  4. microSD card slot 3 elementi
  5. onboard eMMC 2 elementi
  6. onboard eMMC 3 elementi
  7. SATA channels ≥ 1 5 elementi
  8. SATA channels ≥ 2 4 elementi
  9. SATA channels ≥ 3 3 elementi
  10. SATA channels ≥ 4 3 elementi
  11. SD interface 3 elementi
Operating Temperature
  1. -20°C ÷ +60°C 10 elementi
  2. -20°C ÷ +70°C 3 elementi
  3. -40°C ÷ +85°C 6 elementi
  4. 0°C ÷ +50°C 16 elementi
  5. 0°C ÷ +60°C 20 elementi
  6. 20°C ÷ +70°C 10 elementi
  7. -20°C ÷ +70°C 4 elementi
Pci Express
  1. PCI-e lanes ≥ 1 7 elementi
  2. PCI-e lanes ≥ 2 7 elementi
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 1 elemento
  5. PCI-e lanes ≥ 5 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 5 elementi
  2. TTL Uarts ≥2 5 elementi
  3. TTL Uarts ≥3 3 elementi
USB
  1. USB 2.0 ≥ 1 7 elementi
  2. USB 2.0 ≥ 2 6 elementi
  3. USB 2.0 ≥ 3 6 elementi
  4. USB 2.0 ≥ 4 5 elementi
  5. USB 2.0 ≥ 5 3 elementi
  6. USB 2.0 ≥ 6 1 elemento
  7. USB 3.0 ≥ 1 3 elementi
  8. USB 3.0 ≥ 2 2 elementi
  9. USB 3.0 ≥ 3 1 elemento
  10. USB 3.1 ≥ 1 3 elementi
  11. USB 3.2 ≥ 1 3 elementi
  12. USB 3.2 ≥ 2 3 elementi
  13. USB OTG 2 elementi
Video Interfaces
  1. DP 6 elementi
  2. DP++ 2 elementi
  3. DUAL CHANNEL LVDS 5 elementi
  4. eDP 5 elementi
  5. HDMI 3 elementi
  6. MIPI-CSI camera conn 1 elemento
  7. MIPI-DSI 2 elementi
  8. SINGLE CHANNEL LVDS 2 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 10 elementi
  2. M.2 SOCKET 2 KEY 2 elementi
  3. M.2 Socket 2 key B 2 elementi
  4. ONBOARD WI-FI/BLE 11 elementi
  5. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 elemento
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution