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HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - PackagedKit di sviluppo e accessori Accessori Dissipatori Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
DEV-KIT-COM-HPC-ACross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modulesKit di sviluppo e accessori Kit di sviluppo e kit di avvio COM-HPC Development Kit Dev Kits, Carrier Boards and Accessories Starter and Development Kits COM-HPC Development Kit -
Carrier-SMARC-2.0-B79Carrier board for SMARC rel. 2.0 / 2.1.1 compliant modules RB79Kit di sviluppo e accessori Scheda carrier Carrier Board per standard SMARC Dev Kits, Carrier Boards and Accessories Carrier Boards SMARC Carrier Boards -
Carrier-COM-HPC-C78CCHPC-C78-C Carrier boardKit di sviluppo e accessori Scheda carrier Carrier Board per standard COM-HPC Dev Kits, Carrier Boards and Accessories Carrier Boards COM-HPC Carrier Boards -
SOM-COMe-BT6-SKL/KLCOM Express® Basic Type 6 Computer on Module (CoM) with Intel® 6th and 7th generation Core™ / Xeon® (Codename: Skylake and Kaby Lake) Processors. (TARVOS - B09)x86 COM Express® Processore Intel -
SOM-COM-HPC-A-TGL-HComputer on Module (CoM) COM-HPC® Client Size A con processori Intel® Xeon® di undicesima generazione W-11000E Series Core™ vPro® e Celeron® (Codename: Tiger Lake H) per applicazioni FuSa. (LAGOON - D57)x86 COM-HPC® Processore Intel AI-Optimized Hardware