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SOM-COM-HPC-A-Dragonwing-IQ10COM-HPC® 1.3 Client Size A module based on Qualcomm Dragonwing™ IQ10 Series, with up to 700 TOPS of AI Acceleration.Computer on Module COM-HPC® Processori Processore Qualcomm Standard COM-HPC® -
SOM-SMARC-MX952SMARC® Rel. 2.1.1 module with NXP i.MX 952 Applications Processor
Arm Computer on Module SMARC® Processore NXP AI-Optimized Hardware -
SOM-COMe-CT6-Dragonwing-IQ9COM Express® 3.1 Type 6 Compact Module with Qualcomm Dragonwing™ IQ9 Processors. (F99)Computer on Module COM Express® Processore Qualcomm COM Express® -
SOM-SMARC-Dragonwing-IQ8SMARC® Rel. 2.2 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)Arm Computer on Module SMARC® Processore Qualcomm SMARC® -
SOM-COMe-CT6-Dragonwing-IQ-XCOM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)Arm COM Express® Processore Qualcomm -
SOM-Trizeps-X-Genio360SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)Arm Trizeps SODIMM (SOM) Processore Mediatek