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  1. Mass Storage
    SD interface
  2. Video Interfaces
    DP
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Opzioni
Cpu Maker
  1. AMD 1 elemento
  2. Intel 1 elemento
  3. NXP 1 elemento
  4. Qualcomm 1 elemento
Cpu Power Consumption
  1. range 10-25 W 3 elementi
  2. range < 10 W 3 elementi
  3. range < 5 W 1 elemento
  4. range > 25 W 2 elementi
Cpu Type
  1. Intel® Celeron® 1 elemento
  2. Intel® Core™ 1 elemento
  3. Intel® Xeon® 1 elemento
  4. NXP i.MX8 1 elemento
  5. Qualcomm® QCS6490 1 elemento
  6. Zynq® Ultras 1 elemento
Ethernet
  1. ETHERNET≥1 3 elementi
  2. ETHERNET≥2 2 elementi
Form Factor
  1. COM Express® 1 elemento
  2. Qseven 1 elemento
  3. SMARC 2 elementi
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 elementi
  2. ≤ 80 x 80mm 2 elementi
  3. ≥ 100 x 100mm 2 elementi
Form Factor Specification
  1. COM Express Basic 1 elemento
  2. Qseven 70x70 mm 1 elemento
InstallationDepth
  1. memory ≤4 1 elemento
  2. memory ≤1 1 elemento
  3. memory ≤2 1 elemento
  4. soldered down 1 elemento
Memory
  1. memory ≤1 3 elementi
  2. memory ≤16 1 elemento
  3. memory ≤2 3 elementi
  4. memory ≤4 3 elementi
  5. memory ≤8 2 elementi
  6. memory ≥32 1 elemento
  7. soldered down 3 elementi
  8. SO_DIMM 1 elemento
Mass Storage
  1. onboard SSD 2 elementi
  2. standard SATA connector 2 elementi
  3. soldered down 1 elemento
  4. CFAST slot 1 elemento
  5. M.2 NVMe SSD slot 5 elementi
  6. M.2 SATA SSD slot 9 elementi
  7. microSD card slot 7 elementi
  8. onboard eMMC 14 elementi
  9. onboard eMMC 4 elementi
  10. SATA channels ≥ 1 22 elementi
  11. SATA channels ≥ 1 1 elemento
  12. SATA channels ≥ 2 3 elementi
  13. SATA channels ≥ 2 13 elementi
  14. SATA channels ≥ 3 5 elementi
  15. SATA channels ≥ 4 4 elementi
  16. SD interface 4 elementi
  17. SD interface 3 elementi
  18. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 elementi
Operating Temperature
  1. -20°C ÷ +60°C 2 elementi
  2. -40°C ÷ +85°C 2 elementi
  3. 0°C ÷ +50°C 3 elementi
  4. 0°C ÷ +60°C 4 elementi
  5. 20°C ÷ +70°C 2 elementi
Pci Express
  1. PCI-e lanes ≥ 1 3 elementi
  2. PCI-e lanes ≥ 2 3 elementi
  3. PCI-e lanes ≥ 3 2 elementi
  4. PCI-e lanes ≥ 4 2 elementi
  5. PCI-e lanes ≥ 5 1 elemento
ScreenDimension
  1. TTL Uarts ≥1 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 3 elementi
  2. TTL Uarts ≥2 2 elementi
  3. TTL Uarts ≥3 2 elementi
USB
  1. USB 2.0 ≥ 1 4 elementi
  2. USB 2.0 ≥ 2 3 elementi
  3. USB 2.0 ≥ 3 3 elementi
  4. USB 2.0 ≥ 4 2 elementi
  5. USB 2.0 ≥ 5 1 elemento
  6. USB 2.0 ≥ 6 1 elemento
  7. USB 3.0 ≥ 1 3 elementi
  8. USB 3.0 ≥ 2 2 elementi
  9. USB 3.0 ≥ 3 1 elemento
  10. USB 3.0 ≥ 4 1 elemento
  11. USB 3.1 ≥ 1 1 elemento
  12. USB OTG 2 elementi
Video Interfaces
  1. DDI 1 elemento
  2. DP 4 elementi
  3. DP++ 3 elementi
  4. DUAL CHANNEL LVDS 13 elementi
  5. eDP 6 elementi
  6. HDMI 11 elementi
  7. MIPI-CSI camera conn 3 elementi
  8. MIPI-DSI 4 elementi
  9. SINGLE CHANNEL LVDS 14 elementi
  10. VGA 1 elemento
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 elemento
  2. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 elemento
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution