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4 elementi

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Filtri attivi
  1. Memory
    soldered down
  2. USB
    USB 2.0 ≥ 6
  3. Video Interfaces
    SINGLE CHANNEL LVDS
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Opzioni
Cpu Maker
  1. Intel 2 elementi
  2. NVIDIA 1 elemento
  3. Qualcomm 1 elemento
Cpu Power Consumption
  1. range 10-25 W 2 elementi
  2. range < 10 W 3 elementi
Cpu Type
  1. Intel® Atom™ 2 elementi
  2. Intel® Celeron® 2 elementi
  3. Intel® Pentium® 2 elementi
  4. NVIDIA Tegra® T30 1 elemento
  5. Qualcomm Dragonwing 1 elemento
Ethernet
  1. ETHERNET≥1 4 elementi
  2. ETHERNET≥2 1 elemento
Form Factor
  1. COM Express® 1 elemento
  2. Qseven 2 elementi
  3. SMARC 1 elemento
Form Factor Dimensions
  1. ≤ 100 x 100mm 3 elementi
  2. ≤ 80 x 80mm 3 elementi
  3. COM Express® 1 elemento
Form Factor Specification
  1. COM Express Compact 1 elemento
  2. Qseven 70x70 mm 2 elementi
Memory
  1. memory ≤1 12 elementi
  2. memory ≤16 9 elementi
  3. memory ≤2 12 elementi
  4. memory ≤4 12 elementi
  5. memory ≤8 12 elementi
  6. memory ≥32 9 elementi
  7. soldered down 4 elementi
  8. SO_DIMM 13 elementi
  9. UFS 3.1 module on-board 1 elemento
  10. I2C EEPROM 1 elemento
Mass Storage
  1. soldered down 1 elemento
  2. microSD card slot 1 elemento
  3. onboard eMMC 3 elementi
  4. SATA channels ≥ 1 3 elementi
  5. SATA channels ≥ 2 1 elemento
  6. SD interface 3 elementi
  7. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 2 elementi
  2. -40°C ÷ +85°C 3 elementi
  3. 0°C ÷ +50°C 3 elementi
  4. 0°C ÷ +60°C 4 elementi
  5. 20°C ÷ +70°C 3 elementi
Pci Express
  1. PCI-e lanes ≥ 1 3 elementi
  2. PCI-e lanes ≥ 2 3 elementi
  3. PCI-e lanes ≥ 3 3 elementi
  4. PCI-e lanes ≥ 4 3 elementi
  5. PCI-e lanes ≥ 5 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 2 elementi
  2. TTL Uarts ≥2 2 elementi
  3. TTL Uarts ≥3 1 elemento
USB
  1. USB 2.0 ≥ 1 21 elementi
  2. USB 2.0 ≥ 2 19 elementi
  3. USB 2.0 ≥ 3 17 elementi
  4. USB 2.0 ≥ 4 14 elementi
  5. USB 2.0 ≥ 5 9 elementi
  6. USB 2.0 ≥ 6 4 elementi
  7. USB 3.0 ≥ 1 14 elementi
  8. USB 3.0 ≥ 2 11 elementi
  9. USB 3.0 ≥ 3 2 elementi
  10. USB 3.0 ≥ 4 1 elemento
  11. USB 3.1 ≥ 1 2 elementi
  12. USB 3.1 ≥ 2 1 elemento
  13. USB CLIENT 1 elemento
  14. USB OTG 13 elementi
Video Interfaces
  1. DP 2 elementi
  2. DP++ 7 elementi
  3. DUAL CHANNEL LVDS 6 elementi
  4. eDP 8 elementi
  5. HDMI 5 elementi
  6. MIPI-CSI camera conn 5 elementi
  7. MIPI-DSI 1 elemento
  8. SINGLE CHANNEL LVDS 4 elementi
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution