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SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm® IQ8 Applications Processors

SOM-SMARC-ZU

SOM-SMARC-ZU

SMARC® Rel. 2.0 Modul mit Zynq® Ultrascale+™ MPSoC. (RUSSELL - B71)

SOM-SMARC-TWL

SOM-SMARC-TWL

SMARC® Rel. 2.1 compliant module mit Intel® Intel® Core™ i3 Prozessor, Intel® Prozessoren N Series (Codename: Twin Lake). (E08)

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 Prozessor

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 Prozessor

SMARC®

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  1. Form Factor Dimensions
    ≤ 100 x 100mm
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Cpu Maker
  1. AMD 1 item
  2. Intel 4 items
  3. MediaTek 2 items
  4. NXP 4 items
  5. Qualcomm 3 items
Cpu Power Consumption
  1. range 10-25 W 4 items
  2. range < 10 W 4 items
Cpu Type
  1. Intel® Atom™ 4 items
  2. Intel® Celeron® 2 items
  3. Intel® Core™ 1 item
  4. Intel® Pentium® 2 items
  5. MediaTek Genio 510 1 item
  6. MediaTek Genio 700 1 item
  7. NXP i.MX 8M 1 item
  8. NXP i.MX 8M Plus 1 item
  9. NXP i.MX 8X 1 item
  10. NXP i.MX 95 1 item
  11. Qualcomm® QCS5430 1 item
  12. Qualcomm® QCS6490 1 item
  13. Zynq® Ultras 1 item
  14. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 10 items
  2. ETHERNET≥2 11 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 14 items
  2. ≤ 80 x 80mm 8 items
Memory
  1. memory ≤1 12 items
  2. memory ≤16 4 items
  3. memory ≤2 12 items
  4. memory ≤4 12 items
  5. memory ≤8 9 items
  6. soldered down 13 items
  7. memory ≤32 1 item
Mass Storage
  1. onboard eMMC 10 items
  2. onboard eMMC 3 items
  3. SATA channels ≥ 1 5 items
  4. SD interface 6 items
  5. SD interface 3 items
  6. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 10 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 11 items
  4. 0°C ÷ +50°C 10 items
  5. 0°C ÷ +60°C 13 items
  6. 20°C ÷ +70°C 9 items
  7. -20°C ÷ +70°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 10 items
  2. PCI-e lanes ≥ 2 8 items
  3. PCI-e lanes ≥ 3 4 items
  4. PCI-e lanes ≥ 4 6 items
Ttl Uarts
  1. TTL Uarts ≥1 11 items
  2. TTL Uarts ≥2 12 items
  3. TTL Uarts ≥3 8 items
USB
  1. USB 2.0 ≥ 1 12 items
  2. USB 2.0 ≥ 2 12 items
  3. USB 2.0 ≥ 3 10 items
  4. USB 2.0 ≥ 4 8 items
  5. USB 2.0 ≥ 5 7 items
  6. USB 2.0 ≥ 6 5 items
  7. USB 3.0 ≥ 1 5 items
  8. USB 3.0 ≥ 2 6 items
  9. USB 3.1 ≥ 1 5 items
  10. USB 3.1 ≥ 2 1 item
  11. USB 3.2 ≥ 1 1 item
  12. USB 3.2 ≥ 2 2 items
  13. USB OTG 4 items
Video Interfaces
  1. DP 6 items
  2. DP++ 4 items
  3. DUAL CHANNEL LVDS 11 items
  4. eDP 8 items
  5. HDMI 7 items
  6. MIPI-CSI camera conn 6 items
  7. MIPI-DSI 6 items
  8. SINGLE CHANNEL LVDS 6 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. ONBOARD WI-FI/BLE 4 items