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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.2 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

SOM-SMARC-ZU

SOM-SMARC-ZU

SMARC® Rel. 2.0 Modul mit Zynq® Ultrascale+™ MPSoC. (RUSSELL - B71)

SOM-SMARC-TWL

SOM-SMARC-TWL

SMARC® Rel. 2.1 compliant module mit Intel® Intel® Core™ i3 Prozessor, Intel® Prozessoren N Series (Codename: Twin Lake). (E08)

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS6490 processor. (E81)

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS5430 processor. (E81)

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Cpu Maker
  1. AMD 1 item
  2. Intel 5 items
  3. MediaTek 2 items
  4. NXP 5 items
  5. Qualcomm 3 items
Cpu Type
  1. Qualcomm® QCS5430 1 item
  2. Qualcomm® QCS6490 1 item
  3. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 3 items
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 2 items
  4. memory ≤8 2 items
  5. soldered down 3 items
  6. memory ≤32 1 item
Mass Storage
  1. onboard eMMC 2 items
  2. SD interface 3 items
  3. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 2 1 item
  7. USB 3.1 ≥ 1 2 items
Video Interfaces
  1. DP 3 items
  2. DUAL CHANNEL LVDS 3 items
  3. eDP 2 items
  4. MIPI-CSI camera conn 2 items
  5. MIPI-DSI 3 items
  6. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items