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COM Express®
COM-HPC®
Qseven®
SMARC®
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Trizeps SODIMM (SOM)
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  1. Form Factor Specification
    COM-HPC Client
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Cpu Type
  1. Intel® Celeron® 1 item
  2. Intel® Core™ 4 items
  3. Intel® Xeon® 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 3 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
Form Factor Specification
  1. COM Express Basic 8 items
  2. COM Express Compact 13 items
  3. COM-HPC Client 4 items
  4. Qseven 70x70 mm 7 items
  5. µQseven 70x40 4 items
Memory
  1. memory ≤1 1 item
  2. memory ≤16 1 item
  3. memory ≤2 1 item
  4. memory ≤4 1 item
  5. memory ≤8 1 item
  6. memory ≥32 2 items
  7. SO_DIMM 3 items
Mass Storage
  1. M.2 NVMe SSD slot 2 items
  2. M.2 SATA SSD slot 1 item
  3. SATA channels ≥ 1 1 item
  4. SATA channels ≥ 2 2 items
Operating Temperature
  1. -40°C ÷ +85°C 2 items
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 3 items
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 2 items
  7. USB 3.1 ≥ 1 1 item
  8. USB 3.1 ≥ 2 1 item
  9. USB 3.2 ≥ 1 2 items
  10. USB 3.2 ≥ 2 3 items
  11. USB 4.0 ≥ 1 1 item
  12. USB 4.0 ≥ 2 1 item
  13. USB 4.0 ≥ 4 1 item
  14. USB OTG 1 item
Video Interfaces
  1. DDI 3 items
  2. DP 1 item
  3. DP++ 2 items
  4. eDP 4 items
  5. HDMI 4 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®