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  1. Operating Temperature
    0°C ÷ +50°C
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    M.2 SOCKET 1 KEY
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Cpu Maker
  1. AMD 2 items
  2. Intel 8 items
  3. MediaTek 1 item
  4. NXP 3 items
  5. Qualcomm 2 items
Cpu Power Consumption
  1. range 10-25 W 5 items
  2. range < 10 W 5 items
  3. range > 25 W 1 item
Cpu Type
  1. AMD Ryzen™ Embedded 2 items
  2. AMD® Ryzen™ embedded 2 items
  3. Intel® Atom™ 4 items
  4. Intel® Celeron® 3 items
  5. Intel® Core™ 3 items
  6. Intel® Pentium® 3 items
  7. MediaTek Genio 510 1 item
  8. NXP i.MX 95 1 item
  9. NXP i.MX6 1 item
  10. NXP i.MX8 1 item
  11. Qualcomm® QCS5430 1 item
  12. Qualcomm® QCS6490 1 item
Ethernet
  1. ETHERNET≥1 13 items
  2. ETHERNET≥2 14 items
Form Factor
  1. SMARC 4 items
  2. Boxed Solutions 8 items
  3. Single Board Computer 4 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 5 items
  2. ≥ 100 x 100mm 6 items
Form Factor Specification
  1. 3,5" 2 items
  2. Other SBCs 1 item
  3. Pico-ITX 1 item
Memory
  1. memory ≤1 15 items
  2. memory ≤16 7 items
  3. memory ≤2 14 items
  4. memory ≤4 14 items
  5. memory ≤8 14 items
  6. memory ≥32 5 items
  7. soldered down 9 items
  8. SO_DIMM 5 items
Mass Storage
  1. onboard SSD 2 items
  2. M.2 NVMe SSD slot 2 items
  3. M.2 SATA SSD slot 7 items
  4. microSD card slot 3 items
  5. onboard eMMC 5 items
  6. onboard eMMC 5 items
  7. SATA channels ≥ 1 7 items
  8. SATA channels ≥ 2 4 items
  9. SATA channels ≥ 3 3 items
  10. SATA channels ≥ 4 3 items
  11. SD interface 4 items
Operating Temperature
  1. -20°C ÷ +60°C 10 items
  2. -20°C ÷ +70°C 3 items
  3. -40°C ÷ +85°C 6 items
  4. 0°C ÷ +50°C 16 items
  5. 0°C ÷ +60°C 20 items
  6. 20°C ÷ +70°C 10 items
  7. -20°C ÷ +70°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 7 items
  2. PCI-e lanes ≥ 2 7 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 5 items
  2. TTL Uarts ≥2 6 items
  3. TTL Uarts ≥3 3 items
USB
  1. USB 2.0 ≥ 1 10 items
  2. USB 2.0 ≥ 2 9 items
  3. USB 2.0 ≥ 3 6 items
  4. USB 2.0 ≥ 4 5 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 6 items
  8. USB 3.0 ≥ 2 5 items
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.1 ≥ 1 3 items
  11. USB 3.2 ≥ 1 3 items
  12. USB 3.2 ≥ 2 4 items
  13. USB OTG 3 items
Video Interfaces
  1. DP 8 items
  2. DP++ 7 items
  3. DUAL CHANNEL LVDS 6 items
  4. eDP 5 items
  5. HDMI 4 items
  6. MIPI-CSI camera conn 1 item
  7. MIPI-DSI 2 items
  8. SINGLE CHANNEL LVDS 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 16 items
  2. M.2 SOCKET 2 KEY 9 items
  3. M.2 Socket 2 key B 7 items
  4. ONBOARD WI-FI/BLE 16 items
  5. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
  6. /s/n/snapdragon-x_per_sito.jpg 1 item
Unsere Produkte
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Lüfterlose Embedded PCs
  • Industrielle Embedded PCs
  • Payment Systems
  • Entwicklungskits & Zubehör
  • AI-Optimized Hardware
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution