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HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - PackagedEntwicklungskits & Zubehör Zubehör Heat Spreaders Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
Palladio 500 RPL AIModular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 GraphicsProzessor Intel Prozessor Lüfterlose Embedded PCs AI-Optimized Hardware -
SOM-COMe-CT6-TWLCOM Express Rel. 3.1 Type 6 Module mit Intel® Intel® Core™ i3 Prozessor, Intel® Prozessoren N Series (Codename: Twin Lake). (E90)x86 COM Express® Intel Prozessor -
SOM-COMe-CT6-TGL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) mit 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Prozessoren. (CALYPSO - D40)x86 COM Express® Intel Prozessor -
SOM-COMe-CT6-EHLCOM Express® 3.1 Type 6 Compact Computer on Module (CoM) mit Intel® Atom® x6000E Series, Intel® Pentium® und Celeron® N und J Series Prozessoren (Codename: Elkhart Lake). (EUPHORIA - E37)x86 COM Express® Intel Prozessor -
SOM-COMe-CT6-WHL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) mit Intel® Core™ und Celeron™ U-Serie (Codename: Whiskey Lake-U) Prozessoren der 8. (LARISSA - C55)x86 COM Express® Intel Prozessor