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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

Intel 处理器

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  1. USB
    USB 2.0 ≥ 2
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Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 2 items
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 2 items
  3. Intel® Core™ 1 item
  4. Intel® Pentium® 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 3 items
Form Factor
  1. Boxed Solutions 2 items
  2. Single Board Computer 1 item
Form Factor Dimensions
  1. ≥ 100 x 100mm 2 items
Form Factor Specification
  1. 3,5" 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 2 items
  4. memory ≤8 2 items
  5. memory ≥32 1 item
  6. soldered down 2 items
  7. SO_DIMM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. M.2 NVMe SSD slot 1 item
  3. M.2 SATA SSD slot 2 items
  4. onboard eMMC 2 items
  5. SATA channels ≥ 1 2 items
Operating Temperature
  1. -40°C ÷ +85°C 1 item
  2. 0°C ÷ +50°C 2 items
  3. 0°C ÷ +60°C 3 items
Pci Express
  1. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 3.0 ≥ 1 3 items
  4. USB 3.0 ≥ 2 3 items
  5. USB 3.0 ≥ 3 2 items
  6. USB 3.2 ≥ 1 4 items
  7. USB 3.2 ≥ 2 5 items
Video Interfaces
  1. DP 1 item
  2. DP++ 3 items
  3. DUAL CHANNEL LVDS 1 item
  4. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 5 items