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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

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  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 4 items
  3. Intel® Core™ 1 item
  4. Intel® Pentium® 3 items
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 2 items
Form Factor
  1. Single Board Compute 1 item
  2. Boxed Solutions 1 item
  3. Single Board Computer 1 item
  4. Single Board Computer 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
Form Factor Specification
  1. 3,5" 1 item
  2. Other SBCs 2 items
Memory
  1. memory ≤16 1 item
  2. memory ≤8 2 items
  3. memory ≥32 1 item
  4. soldered down 3 items
  5. SO_DIMM 1 item
Mass Storage
  1. standard SATA connector 2 items
  2. M.2 NVMe SSD slot 1 item
  3. M.2 SATA SSD slot 4 items
  4. microSD card slot 2 items
  5. onboard eMMC 2 items
  6. onboard eMMC 1 item
Operating Temperature
  1. -40°C ÷ +85°C 1 item
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 3 items
Pci Express
  1. PCI-e lanes ≥ 4 1 item
Ttl Uarts
  1. TTL Uarts ≥2 4 items
USB
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  2. USB 3.0 ≥ 3 2 items
  3. USB 3.2 ≥ 2 1 item
Video Interfaces
  1. DP++ 4 items
  2. DUAL CHANNEL LVDS 1 item
  3. HDMI 2 items
  4. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 1 item
  4. ONBOARD WI-FI/BLE 2 items