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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

Intel 处理器

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  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 2 items
  3. Intel® Core™ 4 items
  4. Intel® Pentium® 1 item
Ethernet
  1. ETHERNET≥1 4 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM Express® 2 items
  2. COM-HPC® 3 items
  3. Qseven 1 item
  4. SMARC 2 items
  5. Boxed Solutions 5 items
  6. Single Board Computer 1 item
Memory
  1. memory ≤1 4 items
  2. memory ≤16 5 items
  3. memory ≤2 4 items
  4. memory ≤4 4 items
  5. memory ≤8 4 items
  6. memory ≥32 4 items
  7. soldered down 1 item
  8. SO_DIMM 4 items
Mass Storage
  1. M.2 SATA SSD slot 4 items
  2. onboard eMMC 1 item
  3. SATA channels ≥ 1 3 items
  4. SATA channels ≥ 2 3 items
  5. SATA channels ≥ 3 3 items
  6. SATA channels ≥ 4 3 items
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -20°C ÷ +70°C 2 items
  3. 0°C ÷ +50°C 4 items
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 3 items
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
Ttl Uarts
  1. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 3.0 ≥ 1 2 items
  4. USB 3.0 ≥ 2 2 items
  5. USB 3.2 ≥ 1 4 items
  6. USB 3.2 ≥ 2 5 items
Video Interfaces
  1. DP 3 items
  2. DP++ 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 5 items
  2. M.2 SOCKET 2 KEY 2 items