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COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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Cpu Maker
  1. AMD 2 items
  2. Intel 4 items
  3. NXP 11 items
  4. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 7 items
  3. range < 5 W 3 items
Cpu Type
  1. AMD® Ryzen™ embedded 1 item
  2. Intel® Core™ 4 items
  3. Intel® Pentium® 1 item
  4. NXP i.MX 8M 2 items
  5. NXP i.MX 8M Mini 1 item
  6. NXP i.MX 8M Nano 1 item
  7. NXP i.MX 8M Plus 1 item
  8. NXP i.MX 933/935 1 item
  9. NXP i.MX 95 1 item
  10. NXP i.MX6 4 items
  11. NXP i.MX8 1 item
  12. Qualcomm Snapdragon 1 item
  13. Zynq® Ultras 1 item
Ethernet
  1. ETHERNET≥1 13 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM Express® 4 items
  2. COM-HPC® 1 item
  3. Myon MicroModule SOM 2 items
  4. Qseven 5 items
  5. SMARC 5 items
  6. Trizeps SODIMM SOM 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 4 items
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. 48,5 x 32,5 mm 2 items
  4. 67,6 x 36,7 mm 1 item
  5. ≤ 100 x 100mm 8 items
  6. ≤ 80 x 80mm 7 items
  7. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Basic 3 items
  2. COM Express Compact 1 item
  3. COM-HPC Client 1 item
  4. Qseven 70x70 mm 3 items
  5. µQseven 70x40 2 items
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 13 items
  2. memory ≤16 2 items
  3. memory ≤2 14 items
  4. memory ≤4 9 items
  5. memory ≤8 4 items
  6. memory ≥32 3 items
  7. soldered down 9 items
  8. SO_DIMM 2 items
Mass Storage
  1. onboard SSD 1 item
  2. CFAST slot 1 item
  3. M.2 SATA SSD slot 3 items
  4. microSD card slot 2 items
  5. onboard eMMC 12 items
  6. onboard eMMC 1 item
  7. SATA channels ≥ 1 4 items
  8. SATA channels ≥ 2 2 items
  9. SATA channels ≥ 2 1 item
  10. SATA channels ≥ 3 1 item
  11. SD interface 8 items
  12. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 7 items
  2. -40°C ÷ +85°C 13 items
  3. 0°C ÷ +50°C 8 items
  4. 0°C ÷ +60°C 15 items
  5. 20°C ÷ +70°C 7 items
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 10 items
  2. PCI-e lanes ≥ 2 5 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 5 items
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 10 items
  2. TTL Uarts ≥2 8 items
  3. TTL Uarts ≥3 6 items
USB
  1. USB 2.0 ≥ 1 42 items
  2. USB 2.0 ≥ 2 39 items
  3. USB 2.0 ≥ 3 35 items
  4. USB 2.0 ≥ 4 35 items
  5. USB 2.0 ≥ 5 27 items
  6. USB 2.0 ≥ 6 27 items
  7. USB 3.0 ≥ 1 23 items
  8. USB 3.0 ≥ 2 19 items
  9. USB 3.0 ≥ 3 10 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 12 items
  12. USB 3.1 ≥ 2 8 items
  13. USB 3.2 ≥ 1 5 items
  14. USB 3.2 ≥ 2 8 items
  15. USB 4.0 ≥ 1 2 items
  16. USB 4.0 ≥ 2 5 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 2 items
  19. USB CLIENT 2 items
  20. USB OTG 18 items
Video Interfaces
  1. DDI 4 items
  2. DP 3 items
  3. DP++ 1 item
  4. DUAL CHANNEL LVDS 12 items
  5. eDP 6 items
  6. HDMI 11 items
  7. MIPI-CSI camera conn 4 items
  8. MIPI-DSI 4 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 10 items
  11. VGA 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. ONBOARD WI-FI/BLE 4 items
  3. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
模块
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®