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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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  1. Pci Express
    PCI-e lanes ≥ 4
  2. Video Interfaces
    DP
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Cpu Maker
  1. AMD 4 items
  2. Intel 9 items
  3. Qualcomm 1 item
  4. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 7 items
  2. range < 10 W 2 items
  3. range > 25 W 5 items
Cpu Type
  1. AMD Ryzen™ Embedded 2 items
  2. AMD® Ryzen™ embedded 1 item
  3. Intel® Atom™ 4 items
  4. Intel® Celeron® 3 items
  5. Intel® Core™ 7 items
  6. Intel® Pentium® 1 item
  7. Intel® Xeon® 1 item
  8. Rockchip RK3588 1 item
  9. Zynq® Ultras 1 item
  10. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 14 items
  2. ETHERNET≥2 4 items
Form Factor
  1. COM Express® 11 items
  2. COM-HPC® 1 item
  3. SMARC 3 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 10 items
  3. ≤ 80 x 80mm 1 item
  4. ≥ 100 x 100mm 2 items
  5. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 3 items
  2. COM Express Compact 8 items
  3. COM-HPC Client 1 item
Memory
  1. memory ≤1 11 items
  2. memory ≤16 10 items
  3. memory ≤2 11 items
  4. memory ≤4 12 items
  5. memory ≤8 12 items
  6. memory ≥32 8 items
  7. soldered down 3 items
  8. SO_DIMM 11 items
  9. memory ≤32 1 item
Mass Storage
  1. M.2 NVMe SSD slot 2 items
  2. microSD card slot 3 items
  3. onboard eMMC 7 items
  4. onboard eMMC 1 item
  5. SATA channels ≥ 1 13 items
  6. SATA channels ≥ 1 1 item
  7. SATA channels ≥ 2 1 item
  8. SATA channels ≥ 2 10 items
  9. SATA channels ≥ 3 2 items
  10. SATA channels ≥ 4 1 item
  11. SD interface 2 items
  12. SD interface 1 item
  13. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 7 items
  2. -40°C ÷ +85°C 11 items
  3. 0°C ÷ +50°C 10 items
  4. 0°C ÷ +60°C 13 items
  5. 20°C ÷ +70°C 7 items
  6. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 17 items
  2. PCI-e lanes ≥ 2 16 items
  3. PCI-e lanes ≥ 3 13 items
  4. PCI-e lanes ≥ 4 15 items
  5. PCI-e lanes ≥ 5 13 items
Ttl Uarts
  1. TTL Uarts ≥1 12 items
  2. TTL Uarts ≥2 13 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 13 items
  2. USB 2.0 ≥ 2 12 items
  3. USB 2.0 ≥ 3 12 items
  4. USB 2.0 ≥ 4 11 items
  5. USB 2.0 ≥ 5 12 items
  6. USB 2.0 ≥ 6 12 items
  7. USB 3.0 ≥ 1 9 items
  8. USB 3.0 ≥ 2 10 items
  9. USB 3.0 ≥ 3 8 items
  10. USB 3.0 ≥ 4 5 items
  11. USB 3.1 ≥ 1 5 items
  12. USB 3.1 ≥ 2 5 items
  13. USB 3.2 ≥ 1 2 items
  14. USB 3.2 ≥ 2 2 items
  15. USB CLIENT 1 item
  16. USB OTG 1 item
Video Interfaces
  1. DDI 12 items
  2. DP 15 items
  3. DP++ 9 items
  4. DUAL CHANNEL LVDS 17 items
  5. eDP 22 items
  6. HDMI 18 items
  7. MIPI-CSI camera conn 6 items
  8. MIPI-DSI 2 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 16 items
  11. VGA 4 items
模块
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®