Menu
Account
模块
COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

模块

Shop By
Clear All

Items 1-6 of 11

Set Descending Direction
Page
per page
Shop By
现在购物由
  1. Operating Temperature
    0°C ÷ +60°C
  2. Video Interfaces
    MIPI-CSI camera conn
Clear All
Shopping Options
Cpu Maker
  1. Intel 6 items
  2. NXP 2 items
  3. Qualcomm 3 items
Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 3 items
Cpu Type
  1. Intel® Atom™ 2 items
  2. Intel® Celeron® 1 item
  3. Intel® Core™ 5 items
  4. Intel® Pentium® 1 item
  5. NXP i.MX 8M 1 item
  6. NXP i.MX6 1 item
  7. Qualcomm® QCS5430 1 item
  8. Qualcomm Dragonwing 1 item
  9. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 8 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM Express® 4 items
  2. Qseven 1 item
  3. SMARC 6 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 items
  2. ≤ 100 x 100mm 6 items
  3. ≤ 80 x 80mm 4 items
  4. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 3 items
  2. COM Express Compact 1 item
  3. Qseven 70x70 mm 1 item
Memory
  1. memory ≤1 5 items
  2. memory ≤16 2 items
  3. memory ≤2 5 items
  4. memory ≤4 5 items
  5. memory ≤8 3 items
  6. memory ≥32 4 items
  7. soldered down 8 items
  8. SO_DIMM 1 item
  9. memory ≤32 1 item
  10. UFS 3.1 module on-board 1 item
  11. I2C EEPROM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. M.2 NVMe SSD slot 1 item
  4. M.2 SATA SSD slot 2 items
  5. microSD card slot 1 item
  6. onboard eMMC 5 items
  7. onboard eMMC 1 item
  8. SATA channels ≥ 1 5 items
  9. SATA channels ≥ 2 1 item
  10. SATA channels ≥ 2 2 items
  11. SD interface 3 items
  12. SD interface 2 items
  13. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 4 items
  2. -40°C ÷ +85°C 6 items
  3. 0°C ÷ +50°C 5 items
  4. 0°C ÷ +60°C 11 items
  5. 20°C ÷ +70°C 4 items
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 5 items
  2. PCI-e lanes ≥ 2 4 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 5 items
  5. PCI-e lanes ≥ 5 4 items
Ttl Uarts
  1. TTL Uarts ≥1 5 items
  2. TTL Uarts ≥2 7 items
  3. TTL Uarts ≥3 3 items
USB
  1. USB 2.0 ≥ 1 5 items
  2. USB 2.0 ≥ 2 5 items
  3. USB 2.0 ≥ 3 4 items
  4. USB 2.0 ≥ 4 4 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 2.0 ≥ 6 5 items
  7. USB 3.0 ≥ 1 3 items
  8. USB 3.0 ≥ 2 4 items
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.0 ≥ 4 2 items
  11. USB 3.1 ≥ 1 1 item
  12. USB 3.2 ≥ 2 1 item
  13. USB 4.0 ≥ 2 2 items
  14. USB OTG 4 items
Video Interfaces
  1. DDI 17 items
  2. DP 21 items
  3. DP++ 9 items
  4. DUAL CHANNEL LVDS 32 items
  5. eDP 34 items
  6. HDMI 31 items
  7. MIPI-CSI camera conn 11 items
  8. MIPI-DSI 8 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 27 items
  11. VGA 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. ONBOARD WI-FI/BLE 1 item
模块
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®