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COM-HPC®
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SMARC®
Myon MicroModule (SOM)
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现在购物由
  1. Mass Storage
    onboard eMMC
  2. USB
    USB 3.0 ≥ 2
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Cpu Maker
  1. AMD 1 item
  2. Intel 4 items
  3. NXP 5 items
Cpu Power Consumption
  1. range 10-25 W 4 items
  2. range < 10 W 5 items
  3. range < 5 W 2 items
  4. range > 25 W 1 item
Cpu Type
  1. Intel® Atom™ 4 items
  2. Intel® Celeron® 3 items
  3. Intel® Core™ 1 item
  4. Intel® Pentium® 3 items
  5. NXP i.MX 8M 2 items
  6. NXP i.MX 8M Plus 2 items
  7. NXP i.MX 8X 1 item
  8. Zynq® Ultras 1 item
Ethernet
  1. ETHERNET≥1 8 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM Express® 2 items
  2. Qseven 1 item
  3. SMARC 5 items
  4. Trizeps SODIMM SOM 2 items
Form Factor Dimensions
  1. 67,6 x 36,7 mm 2 items
  2. ≤ 100 x 100mm 7 items
  3. ≤ 80 x 80mm 6 items
  4. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Compact 2 items
  2. Qseven 70x70 mm 1 item
Memory
  1. memory ≤1 10 items
  2. memory ≤16 1 item
  3. memory ≤2 10 items
  4. memory ≤4 10 items
  5. memory ≤8 7 items
  6. soldered down 6 items
  7. SO_DIMM 2 items
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 1 item
  3. microSD card slot 1 item
  4. onboard eMMC 10 items
  5. onboard eMMC 3 items
  6. SATA channels ≥ 1 9 items
  7. SATA channels ≥ 1 3 items
  8. SATA channels ≥ 2 10 items
  9. SATA channels ≥ 3 2 items
  10. SATA channels ≥ 4 1 item
  11. SD interface 7 items
  12. SD interface 1 item
  13. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 6 items
  2. -40°C ÷ +85°C 10 items
  3. 0°C ÷ +50°C 7 items
  4. 0°C ÷ +60°C 8 items
  5. 20°C ÷ +70°C 7 items
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 9 items
  2. PCI-e lanes ≥ 2 6 items
  3. PCI-e lanes ≥ 3 5 items
  4. PCI-e lanes ≥ 4 5 items
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 9 items
  2. TTL Uarts ≥2 8 items
  3. TTL Uarts ≥3 6 items
USB
  1. USB 2.0 ≥ 1 22 items
  2. USB 2.0 ≥ 2 20 items
  3. USB 2.0 ≥ 3 16 items
  4. USB 2.0 ≥ 4 15 items
  5. USB 2.0 ≥ 5 11 items
  6. USB 2.0 ≥ 6 11 items
  7. USB 3.0 ≥ 1 12 items
  8. USB 3.0 ≥ 2 10 items
  9. USB 3.0 ≥ 3 2 items
  10. USB 3.0 ≥ 4 1 item
  11. USB 3.1 ≥ 1 4 items
  12. USB 3.1 ≥ 2 3 items
  13. USB 3.2 ≥ 1 2 items
  14. USB 3.2 ≥ 2 4 items
  15. USB OTG 12 items
Video Interfaces
  1. DDI 2 items
  2. DP 3 items
  3. DP++ 2 items
  4. DUAL CHANNEL LVDS 8 items
  5. eDP 5 items
  6. HDMI 8 items
  7. MIPI-CSI camera conn 2 items
  8. MIPI-DSI 5 items
  9. PARALLEL RGB 2 items
  10. SINGLE CHANNEL LVDS 9 items
  11. VGA 1 item
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 3 items
模块
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®