Menu
Account
无风扇嵌入式计算机

最新产品

/images/fanless-pc/palladio-500-rpl-ai-main.jpg

Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

/images/fanless-pc/modular-link-iq-615-front.jpg

Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Fanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codeame: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)

无风扇嵌入式计算机

Shop By
Clear All

2 Items

Set Descending Direction
per page
Shop By
现在购物由
  1. Cpu Type
    Intel® Pentium®
  2. Memory
    memory ≤8
Clear All
Shopping Options
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
Cpu Type
  1. Intel® Atom™ 3 items
  2. Intel® Celeron® 3 items
  3. Intel® Core™ 3 items
  4. Intel® Pentium® 2 items
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 2 items
Form Factor
  1. Boxed Solutions 1 item
Form Factor Dimensions
  1. ≥ 100 x 100mm 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤16 1 item
  3. memory ≤2 1 item
  4. memory ≤4 1 item
  5. memory ≤8 2 items
  6. soldered down 2 items
Mass Storage
  1. M.2 SATA SSD slot 1 item
  2. microSD card slot 1 item
  3. onboard eMMC 1 item
  4. onboard eMMC 1 item
  5. SATA channels ≥ 1 1 item
Operating Temperature
  1. 0°C ÷ +50°C 2 items
  2. 0°C ÷ +60°C 1 item
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 3.0 ≥ 1 1 item
Video Interfaces
  1. DP++ 2 items
  2. HDMI 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 SOCKET 2 KEY 1 item
  3. M.2 Socket 2 key B 1 item
  4. ONBOARD WI-FI/BLE 1 item