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SMARC® Rel. 2.1.1 module with NXP i.MX 952 Applications Processor
Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics
COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)
不带风扇的嵌入式计算机,配备第11代英特尔® Core™和英特尔® Celeron® SoCs(代号:Tiger Lake UP3)以及Axelera AI芯片:由单个Metis AIPU提供动力,最高可达120 TOPS
SMARC® 2.1.1 module powered by Qualcomm Dragonwing™ QCS6490 processor. (E81)