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USA 我们的产品
面向最具创新性项目的一系列广泛的 SECO 产品：模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案，以及载板、入门套件和所有能有助完成您的项目的配件。
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SOM-COMe-CT6-ASL采用Intel Atom® x7000E系列处理器（代号：Amston Lake和Alder Lake N）的COM Express® 3.1 Type 6紧凑型模块 -
SOM-COMe-BT6-MTLCOM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U) -
SOM-COM-HPC-A-MTLCOM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U) -
Palladio 400 RPLModular fanless embedded PC with 13th Gen Intel® Core™ processors -
Palladio 500 RPLModular fanless embedded PC with 13th Gen Intel® Core™ processors -
SBC-3.5-RV10003.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90) -
SOM-COM-HPC-A-TGL-UP3COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77) -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80) -
SBC-pITX-BTPico-ITX SBC with Intel® Atom™ E3800 (codename: Bay Trail) Processors. (LAMPOS - A44) -
DEV-KIT-COM-HPC-ACross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules
