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USA 我们的产品
面向最具创新性项目的一系列广泛的 SECO 产品：模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案，以及载板、入门套件和所有能有助完成您的项目的配件。
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SOM-SMARC-ASL符合SMARC® Rel 2.1标准的模块，采用用于Edge应用的Intel Atom® x7000RE系列处理器 -
SOM-COM-HPC-A-MTLCOM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U) -
SOM-SMARC-MX95SMARC® Rel. 2.1.1 module with NXP i.MX 95 Applications Processors -
SOM-SMARC-QCS5430SMARC® 2.1.1 module with Qualcomm® QCS5430 processor -
SOM-SMARC-QCS6490SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor -
SOM-COM-HPC-A-TGL-UP3COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77) -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80) -
Titan 290 EHLFanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codeame: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC) -
Titan 300 TGL-UP3Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC) -
SBC-3.5-MX83.5" SBC with NXP i.MX8 Applications Processors. (THEMIS - C43)