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USA 我们的产品
面向最具创新性项目的一系列广泛的 SECO 产品：模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案，以及载板、入门套件和所有能有助完成您的项目的配件。
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Palladio 400 RPLModular fanless embedded PC with 13th Gen Intel® Core™ processors -
Palladio 500 RPLModular fanless embedded PC with 13th Gen Intel® Core™ processors -
Modular Link MX93DIN Mount Industrial Gateway with the NXP i.MX 93 SoC -
Titan 225 RK3399Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC) -
Titan 220 APL MedBoxed Gateway for Medical applications with Intel® Atom™ x5-E3930 Processors. (DRACO - SYS-D14-MED) -
Titan 235 APLFanless Embedded Computer with Intel® Atom™ X Series (codename: Apollo Lake) Processors. (CYGNUS - SYS-B68-IPC) -
Titan 230 APLFanless Embedded Computer with Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (HYDRUS - SYS-B68-IGW) -
Titan 290 EHLFanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codeame: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC) -
Titan 300 TGL-UP3Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC) -
Titan 300 TGL-UP3 AI不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS