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Cpu Maker
  1. AMD 12 items
  2. Arm System ready NXP 1 item
  3. Intel 41 items
  4. MediaTek 6 items
  5. NVIDIA 1 item
  6. NXP 31 items
  7. Qualcomm 11 items
  8. Rockchip 3 items
  9. Espressif 1 item
  10. Raspberry Pi 1 item
Cpu Power Consumption
  1. range 10-25 W 21 items
  2. range < 10 W 26 items
  3. range < 5 W 1 item
  4. range > 25 W 12 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 4 items
  3. AMD® G-Series™ 1 item
  4. AMD® R-Series 1 item
  5. AMD® Ryzen™ embedded 6 items
  6. Espressif ESP32-D0WD 2 items
  7. Intel® Atom™ 20 items
  8. Intel® Celeron® 17 items
  9. Intel® Core™ 20 items
  10. Intel® Pentium® 14 items
  11. Intel® Xeon® 3 items
  12. MediaTek Genio 510 3 items
  13. MediaTek Genio 700 3 items
  14. NVIDIA Tegra® T30 1 item
  15. NXP i.MX 8M 3 items
  16. NXP i.MX 8M Mini 3 items
  17. NXP i.MX 8M Nano 1 item
  18. NXP i.MX 8M Plus 4 items
  19. NXP i.MX 8X 2 items
  20. NXP i.MX 93 2 items
  21. NXP i.MX 933/935 1 item
  22. NXP i.MX 95 2 items
  23. NXP i.MX6 11 items
  24. NXP i.MX8 3 items
  25. Qualcomm® QCS5430 1 item
  26. Qualcomm® QCS6490 4 items
  27. Rockchip RK3399 1 item
  28. Rockchip RK3568 1 item
  29. Rockchip RK3588 1 item
  30. Zynq® Ultras 1 item
  31. Qualcomm Dragonwing IQ-2390 1 item
  32. Qualcomm Dragonwing IQ-X 1 item
  33. Qualcomm Dragonwing IQ9 1 item
  34. NXP i.MX 952 1 item
Ethernet
  1. ETHERNET≥1 87 items
  2. ETHERNET≥2 41 items
Form Factor
  1. COM Express® 22 items
  2. COM-HPC® 6 items
  3. ESP32 1 item
  4. Qseven 9 items
  5. Single Board Compute 2 items
  6. SMARC 17 items
  7. Boxed Solutions 8 items
  8. Modular HMIs 17 items
  9. Single Board Computer 3 items
  10. Single Board Computer 23 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 6 items
  2. 40x70 mm (µQseven, 1.57"x 2.76") 2 items
  3. ≤ 100 x 100mm 38 items
  4. ≤ 80 x 80mm 17 items
  5. ≥ 100 x 100mm 27 items
  6. COM Express® 4 items
Form Factor Specification
  1. 3,5" 8 items
  2. COM Express Basic 9 items
  3. COM Express Compact 12 items
  4. COM-HPC Client 4 items
  5. embedded NUC 1 item
  6. ESP32 form factor 1 item
  7. Other SBCs 11 items
  8. Pico-ITX 6 items
  9. Qseven 70x70 mm 6 items
  10. µQseven 70x40 3 items
  11. ≤ 100 x 100mm 1 item
  12. ≥ 100 x 100mm 1 item
InstallationDepth
  1. 30-35 2 items
  2. 35-40 2 items
  3. memory ≤4 1 item
  4. memory ≤1 2 items
  5. memory ≤2 2 items
  6. soldered down 2 items
Memory
  1. memory ≤1 65 items
  2. memory ≤16 28 items
  3. memory ≤2 59 items
  4. memory ≤4 51 items
  5. memory ≤8 42 items
  6. memory ≥32 22 items
  7. soldered down 48 items
  8. SO_DIMM 26 items
  9. memory ≤32 1 item
  10. UFS 3.1 module on-board 1 item
  11. I2C EEPROM 2 items
  12. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mounting Option
  1. VESA Mount 11 items
  2. Rear Mount 12 items
  3. Panel Mount 11 items
  4. Flush Mount 12 items
Mass Storage
  1. mSATA half-size slot 1 item
  2. onboard SSD 4 items
  3. standard SATA connector 8 items
  4. soldered down 1 item
  5. CFAST slot 2 items
  6. I2C EEPROM 1 item
  7. M.2 NVMe SSD slot 10 items
  8. M.2 SATA SSD slot 19 items
  9. microSD card slot 28 items
  10. onboard eMMC 3 items
  11. onboard eMMC 37 items
  12. onboard eMMC 34 items
  13. SATA channels ≥ 1 32 items
  14. SATA channels ≥ 1 6 items
  15. SATA channels ≥ 2 1 item
  16. SATA channels ≥ 2 5 items
  17. SATA channels ≥ 2 21 items
  18. SATA channels ≥ 3 5 items
  19. SATA channels ≥ 4 4 items
  20. SD interface 17 items
  21. SD interface 22 items
  22. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  23. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 41 items
  2. -20°C ÷ +70°C 6 items
  3. -40°C ÷ +85°C 66 items
  4. 0°C ÷ +50°C 65 items
  5. 0°C ÷ +60°C 111 items
  6. 20°C ÷ +70°C 38 items
  7. -20°C ÷ +70°C 9 items
  8. -20°C ÷ +70°C 3 items
  9. -40°C ÷ +60°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 42 items
  2. PCI-e lanes ≥ 2 34 items
  3. PCI-e lanes ≥ 3 23 items
  4. PCI-e lanes ≥ 4 30 items
  5. PCI-e lanes ≥ 5 23 items
  6. 0°C ÷ +50°C 1 item
  7. 0°C ÷ +60°C 1 item
ScreenDimension
  1. 10-14 4 items
  2. 14-19 1 item
  3. 5 items
  4. TTL Uarts ≥1 1 item
  5. RS232 1 item
Ttl Uarts
  1. TTL Uarts ≥1 41 items
  2. TTL Uarts ≥2 46 items
  3. TTL Uarts ≥3 16 items
USB
  1. USB 2.0 ≥ 1 68 items
  2. USB 2.0 ≥ 2 56 items
  3. USB 2.0 ≥ 3 43 items
  4. USB 2.0 ≥ 4 37 items
  5. USB 2.0 ≥ 5 28 items
  6. USB 2.0 ≥ 6 26 items
  7. USB 3.0 ≥ 1 33 items
  8. USB 3.0 ≥ 2 26 items
  9. USB 3.0 ≥ 3 14 items
  10. USB 3.0 ≥ 4 8 items
  11. USB 3.1 ≥ 1 12 items
  12. USB 3.1 ≥ 2 9 items
  13. USB 3.2 ≥ 1 9 items
  14. USB 3.2 ≥ 2 10 items
  15. USB 4.0 ≥ 1 2 items
  16. USB 4.0 ≥ 2 5 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 1 item
  19. USB CLIENT 6 items
  20. USB OTG 32 items
Video Interfaces
  1. DDI 18 items
  2. DP 32 items
  3. DP++ 23 items
  4. DUAL CHANNEL LVDS 47 items
  5. eDP 49 items
  6. HDMI 54 items
  7. MIPI-CSI camera conn 15 items
  8. MIPI-DSI 10 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 45 items
  11. VGA 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 21 items
  2. M.2 SOCKET 2 KEY 9 items
  3. M.2 Socket 2 key B 9 items
  4. ONBOARD WI-FI/BLE 20 items
  5. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
  6. /M/o/Modular_7_ombra_Tavola_disegno_1_1_1.jpg 1 item
  7. /s/n/snapdragon-x_per_sito.jpg 1 item
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • Evaluation Kit
  • Touch Display Solutions