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SOM-COMe-CT6-R1000

SOM-COMe-CT6-R1000

COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded R1000 family of SoCs. (METIS - C89)

数据表

Wiki

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中央处理器

AMD Ryzen™ Embedded R1000 processors

图形

AMD Radeon™ Vega GPU with 3 Compute Units

连接

4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3

记忆

Two DDR4 SO-DIMM Slots supporting DDR4-2400 ECC Memory

产品详情

技术信息

说明	Low-end AMD Ryzen® on COM Express® Type 6 Compact Computer on Module (CoM)
中央处理器说明	AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.6GHz (3.5 Boost), TDP 12-25W AMD Ryzen™ Embedded R1505G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.4GHz (3.3 Boost), TDP 12-25W AMD Ryzen™ Embedded R1305G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 1.5GHz (2.8 Boost), TDP 8-10W
最大核数	2
内存说明	Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 32GB
图形说明	AMD Radeon™ Vega 3 GPU with 3 Compute Units DirectX® 12 supported H.265 (10-bit) decode and 8-bit video encode VP9 decode 3 independent displays supported
视频界面说明	Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0I eDP or Single/Dual-Channel 18-/24- bit LVDS interface (factory alternatives to third DDI port)
视频分辨率说明	DDIs, eDP: up to 4K LVDS: up to 1920 x 1200 @ 60Hz
大容量存储器说明	2 x S-ATA Gen3 Channels
网络说明	Gigabit Ethernet interface Intel® I21x family GbE Controller
USB说明	Up to 4 x USB 3.0 Host ports 8 x USB 2.0 Host ports
Pci Description	2 x PCI-e x1 Gen3 lanes Additional 3rd PCI-e x1 Gen3 lane or 3x PCI-e x1 Gen2 lanes (factory alternatives) PCI-express Graphics (PEG) x4
音频说明	HD Audio Interface
串行端口	2 x UARTs
其他接口	SPI, I2C, SM Bus, LPC bus, FAN management Optional TPM 2.0 module on-board 4x GPI, 4 x GPO
电源	+12VDC ± 10% and +5VSB (optional)
操作系统	Windows 10 64-bit Linux
操作温度说明	0°C ÷ +60 °C (Commercial version) -40°C ÷ +85°C (Industrial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
尺寸	95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

软件

链接	SECO Technical Resources

文件

Data Sheet	[Datasheet] SOM-COMe-CT6-R1000 Rel 1.3
Manual	[Manual] SOM-COMe-CT6-R1000 Rel 1.1
Image	[Picture] SOM-COMe-CT6-R1000_front [Picture] SOM-COMe-CT6-R1000_back

Part Number

组合的产品项目
MC89-1002-2211-C0-V	部件编号说明 COMe-C89-CT6 w/AMD Ryzen Embedded R1606G @2.6GHz 15W, GbE I211, 2x DDI & LVDS, TPM1.2, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 - Comm. Temp	联系我们
MC89-2002-2211-C0-V	部件编号说明 COMe-C89-CT6 w/AMD Ryzen Embedded R1505G @ 2.4GHz 15W, GbE I211, 2x DDI & LVDS, TPM1.2, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 -Comm. Temp	联系我们
MC89-3002-2222-C0-V	部件编号说明 COMe-C89-CT6 w/AMD Ryzen Embedded R1305G @ 1.5GHz 8W, GbE I211, 2x DDI & LVDS, TPM1.2, 2xUSB3.0, 3x PCIe Gen3 - Comm. Temp	联系我们
MC89-1001-1212-C0-V	部件编号说明 COMe-C89-CT6 w/AMD Ryzen Embedded R1606G @ 2.6GHz 15W, GbE I210, eDP, TPM SLB 9670 Q1.2, HUB - Comm. Temp	联系我们
MC89-2001-1212-C0-V	部件编号说明 COMe-C89-CT6 w/AMD Ryzen Embedded R1505G @ 2.4GHz 15W, GbE I210, eDP, TPM SLB 9670 Q1.2, HUB - Comm. Temp	联系我们