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Cpu Maker
  1. AMD 1 item
  2. Arm System ready NXP 1 item
  3. Intel 9 items
  4. MediaTek 2 items
  5. NXP 8 items
  6. Qualcomm 3 items
  7. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 4 items
  2. range < 10 W 13 items
Cpu Type
  1. Intel® Atom™ 7 items
  2. Intel® Celeron® 7 items
  3. Intel® Core™ 1 item
  4. Intel® Pentium® 7 items
  5. MediaTek Genio 510 1 item
  6. MediaTek Genio 700 1 item
  7. NXP i.MX 8M 2 items
  8. NXP i.MX 8M Mini 2 items
  9. NXP i.MX 8M Nano 1 item
  10. NXP i.MX 8X 2 items
  11. NXP i.MX6 2 items
  12. NXP i.MX8 1 item
  13. Qualcomm® QCS5430 1 item
  14. Qualcomm® QCS6490 1 item
  15. Rockchip RK3568 1 item
  16. Zynq® Ultras 1 item
  17. Qualcomm Dragonwing 1 item
Ethernet
  1. ETHERNET≥1 22 items
  2. ETHERNET≥2 14 items
Form Factor
  1. COM Express® 1 item
  2. Qseven 5 items
  3. Single Board Compute 1 item
  4. SMARC 11 items
  5. Boxed Solutions 1 item
  6. Single Board Computer 1 item
  7. Single Board Computer 5 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. ≤ 100 x 100mm 16 items
  4. ≤ 80 x 80mm 9 items
  5. ≥ 100 x 100mm 4 items
  6. COM Express® 1 item
Form Factor Specification
  1. 3,5" 4 items
  2. COM Express Compact 1 item
  3. Other SBCs 2 items
  4. Pico-ITX 1 item
  5. Qseven 70x70 mm 3 items
  6. µQseven 70x40 2 items
Memory
  1. memory ≤1 39 items
  2. memory ≤16 18 items
  3. memory ≤2 38 items
  4. memory ≤4 37 items
  5. memory ≤8 30 items
  6. memory ≥32 15 items
  7. soldered down 25 items
  8. SO_DIMM 20 items
  9. UFS 3.1 module on-board 1 item
  10. I2C EEPROM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. standard SATA connector 3 items
  3. soldered down 1 item
  4. M.2 SATA SSD slot 4 items
  5. microSD card slot 7 items
  6. onboard eMMC 2 items
  7. onboard eMMC 19 items
  8. onboard eMMC 3 items
  9. SATA channels ≥ 1 6 items
  10. SATA channels ≥ 2 1 item
  11. SD interface 8 items
  12. SD interface 2 items
  13. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 16 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 17 items
  4. 0°C ÷ +50°C 18 items
  5. 0°C ÷ +60°C 23 items
  6. 20°C ÷ +70°C 15 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 14 items
  2. PCI-e lanes ≥ 2 8 items
  3. PCI-e lanes ≥ 3 4 items
  4. PCI-e lanes ≥ 4 6 items
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 25 items
  2. TTL Uarts ≥2 25 items
  3. TTL Uarts ≥3 14 items
USB
  1. USB 2.0 ≥ 1 17 items
  2. USB 2.0 ≥ 2 18 items
  3. USB 2.0 ≥ 3 16 items
  4. USB 2.0 ≥ 4 13 items
  5. USB 2.0 ≥ 5 8 items
  6. USB 2.0 ≥ 6 6 items
  7. USB 3.0 ≥ 1 7 items
  8. USB 3.0 ≥ 2 4 items
  9. USB 3.0 ≥ 3 2 items
  10. USB 3.0 ≥ 4 1 item
  11. USB 3.1 ≥ 1 5 items
  12. USB 3.1 ≥ 2 1 item
  13. USB 3.2 ≥ 1 1 item
  14. USB 3.2 ≥ 2 5 items
  15. USB OTG 8 items
Video Interfaces
  1. DP 7 items
  2. DP++ 9 items
  3. DUAL CHANNEL LVDS 19 items
  4. eDP 17 items
  5. HDMI 13 items
  6. MIPI-CSI camera conn 8 items
  7. MIPI-DSI 5 items
  8. SINGLE CHANNEL LVDS 13 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 7 items
  2. M.2 SOCKET 2 KEY 4 items
  3. ONBOARD WI-FI/BLE 8 items
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution