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  1. Cpu Type
    Intel® Core™
  2. Operating Temperature
    -20°C ÷ +60°C
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Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 2 items
  4. Espressif ESP32-D0WD 1 item
  5. Intel® Atom™ 8 items
  6. Intel® Celeron® 6 items
  7. Intel® Core™ 7 items
  8. Intel® Pentium® 6 items
  9. MediaTek Genio 510 1 item
  10. MediaTek Genio 700 1 item
  11. NVIDIA Tegra® T30 1 item
  12. NXP i.MX 8M 3 items
  13. NXP i.MX 8M Mini 2 items
  14. NXP i.MX 8M Nano 1 item
  15. NXP i.MX 8X 2 items
  16. NXP i.MX 93 1 item
  17. NXP i.MX 95 1 item
  18. NXP i.MX6 3 items
  19. NXP i.MX8 2 items
  20. Qualcomm® QCS5430 1 item
  21. Qualcomm® QCS6490 1 item
  22. Rockchip RK3399 1 item
  23. Zynq® Ultras 1 item
  24. Qualcomm Dragonwing IQ-X 1 item
Ethernet
  1. ETHERNET≥1 7 items
  2. ETHERNET≥2 3 items
Form Factor
  1. COM Express® 4 items
  2. Boxed Solutions 3 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 4 items
Form Factor Specification
  1. COM Express Compact 4 items
Memory
  1. memory ≤1 7 items
  2. memory ≤16 7 items
  3. memory ≤2 7 items
  4. memory ≤4 7 items
  5. memory ≤8 7 items
  6. memory ≥32 4 items
  7. SO_DIMM 6 items
Mass Storage
  1. M.2 SATA SSD slot 3 items
  2. onboard eMMC 3 items
  3. SATA channels ≥ 1 7 items
  4. SATA channels ≥ 2 7 items
  5. SATA channels ≥ 3 3 items
  6. SATA channels ≥ 4 3 items
Operating Temperature
  1. -20°C ÷ +60°C 7 items
  2. -20°C ÷ +70°C 3 items
  3. -40°C ÷ +85°C 10 items
  4. 0°C ÷ +50°C 11 items
  5. 0°C ÷ +60°C 20 items
  6. 20°C ÷ +70°C 6 items
  7. -20°C ÷ +70°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 6 items
  2. PCI-e lanes ≥ 2 6 items
  3. PCI-e lanes ≥ 3 4 items
  4. PCI-e lanes ≥ 4 4 items
  5. PCI-e lanes ≥ 5 4 items
Ttl Uarts
  1. TTL Uarts ≥1 4 items
  2. TTL Uarts ≥2 4 items
USB
  1. USB 2.0 ≥ 1 4 items
  2. USB 2.0 ≥ 2 4 items
  3. USB 2.0 ≥ 3 4 items
  4. USB 2.0 ≥ 4 4 items
  5. USB 2.0 ≥ 5 4 items
  6. USB 2.0 ≥ 6 4 items
  7. USB 3.0 ≥ 1 3 items
  8. USB 3.0 ≥ 2 3 items
  9. USB 3.0 ≥ 3 3 items
  10. USB 3.1 ≥ 1 3 items
  11. USB 3.1 ≥ 2 3 items
  12. USB 3.2 ≥ 1 3 items
  13. USB 3.2 ≥ 2 3 items
Video Interfaces
  1. DDI 3 items
  2. DP 6 items
  3. DUAL CHANNEL LVDS 3 items
  4. eDP 3 items
  5. HDMI 3 items
  6. SINGLE CHANNEL LVDS 3 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution