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Titan 300 TGL-UP3Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)Intel 处理器 无风扇嵌入式计算机 -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)x86 模块 COM-HPC® Intel 处理器 人工智能优化硬件 -
SBC-3.5-TGL-UP3SBC 3.5” con processori Intel® Core™ e Celeron® di undicesima generazione (codename: Tiger Lake-UP3). (PRISMA - D64)Intel 处理器 SBC 3.5-inch SBC -
Palladio 500 RPL AIModular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics处理器 Intel 处理器 无风扇嵌入式计算机 人工智能优化硬件 -
SOM-COMe-CT6-TGL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Processors. (CALYPSO - D40)x86 COM Express® Intel 处理器 -
SOM-COMe-CT6-WHL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 8th Gen Intel® Core™ and Celeron™ U-series (Codename: Whiskey Lake-U) Processors. (LARISSA - C55)x86 COM Express® Intel 处理器