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COM Express®
For high-end design and markets
High graphic processing capabilities
Rich functionality
For high-performance projects
2 formats: Basic (4.92 x 3.74 in) and Compact (3. 74 x 3.74 in)
Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description
The COM Express® standard lets you customize your projects quickly and cost-effectively. SECO modules are available in COM Express® Type 6 and Type 7, in two formats: “Basic”, with dimensions of 4.92 x 3.74 in, suited to highly energy-sensitive devices, and “Compact”, 3.74 x 3.74 in, a good compromise between high performance and reduced size.
COM Express® Interfaces
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SOM-COMe-BT7-E3000COM Express® Rel.3.0 Basic Type 7 Computer on Module (CoM) with the AMD EPYC™ Embedded 3000 Series of SoCs. (THEBE - C42) -
SOM-COMe-CT6-WHL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 8th Gen Intel® Core™ and Celeron™ U-series (Codename: Whiskey Lake-U) Processors. (LARISSA - C55) -
SOM-COMe-BT6-SKL/KLCOM Express® Basic Type 6 Computer on Module (CoM) with Intel® 6th and 7th generation Core™ / Xeon® (Codename: Skylake and Kaby Lake) CPUs. (TARVOS - B09) -
SOM-COMe-CT6-ASLCOM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000E Series (Codename: Amston Lake and Alder Lake N)
