SOM-COMe-CT6-WHL-U
Product details
Description | Low power multi-core Intel® architecture for mobile applications |
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Cpu | Intel® Core™ i7-8665UE, Quad Core @ 1.7GHz (Turbo Boost 4.4GHz) with HT, 8MB Cache, 15W TDP (12.5W..25W cTDP) |
Max Cores | 4 |
Memory | Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 64GB |
Graphics | Intel® UHD Graphics 620 (Core™ processors), 610 (Celeron™ processor) |
Video Interfaces | Up to 2 x Digital Display Interfaces (DDIs), supporting DP 1.2, eDP 1.4, HDMI 1.4 and DVI |
Video Resolution | eDP, DP: up to 4096 x 2304 @60Hz |
Mass Storage | Up to 3 x S-ATA Gen3 Channels |
Networking | Gigabit Ethernet interface |
Usb | 4 x USB 3.1 Host ports |
Pci | Up to 8 x PCI-e x 1 lanes |
Audio | HD Audio Interface |
Serial Ports | 2 x UARTs |
Other Interfaces | SPI, I2C, SM Bus, LPC bus, FAN management |
Power Supply | +12VDC ± 10% and + 5VSB (optional) |
Operating System | Microsoft Windows 10 Enterprise / IoT |
Operating Temperature | 0°C ÷ +60 °C (Commercial version) *Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Dimensions | 95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout) |
MC55-3001-6120-C0-V | Part Number Description COMe-C55 w/Intel Whiskey Lake U i7-8665UE Quad Core @ 1.8GHz, 8MB Cache, 15W TDP, 8 PCIE + 0 PEG + 2 SATA, EDP, DP su DDI2, TPMSLB 9670, 3wire FAN, Comm.Temp. | |
MC55-4003-2010-C0-V | Part Number Description COM Express Type 6 - COMe-C55 w/ Intel® Whiskey Lake U Celeron 4305UE Dual Core, 5 PCIE + 4 PEG + 2 SATA, LVDS, 4wire Fan, CommTemp | |
MC55-4003-7020-C0-V | Part Number Description COM Express Type 6 - COMe-C55 w/ Intel® Whiskey Lake U 4305UE Dual Core @ 2.2GHz, 5 PCIE + 4 PEG + 2 SATA, LVDS + VGA, 3wire FAN, Comm Temp. |
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