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Modules
Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description
The wide range of SECO’s off-the-shelf Computer-on-Modules offers the possibility of creating solutions with reduced time-to-market. Discover all of our standards: Qseven®, SMARC, COM Express®, ETX® and COM-HPC™.
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CALYPSOCOM Express® Rel. 3.0 Compact Type 6 Module with 11th Gen Intel® Core™ (formerly Tiger Lake UP3) Processors -
ORIONCOM-HPC® Client module Size A with 12th Gen Intel® Core™ (formerly Alder Lake - P series) Processors -
LAGOONCOM-HPC® Client module Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (formerly Tiger Lake-H) Processors for FuSa applications -
TARVOSCOM Express® Basic Type 6 with Intel® 6th and 7th generation Core™ / Xeon® (formerly Skylake and Kaby Lake) CPUs -
OBERONCOM Express® Rel. 3.0 Basic Type 6 module with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake) and 9th generation Core™ / Xeon® / Celeron® (formerly Coffee Lake Refresh) Processors -
LARISSACOM Express® Rel. 3.0 Compact Type 6 module with 8th Gen Intel® Core™ and Celeron™ U-series (formerly Whiskey Lake-U) Processors -
FINLAYSMARC® Rel. 2.1 compliant module with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N)