Boxed Solutions

Boxed Solutions

Off-The-Shelf Solutions
Experience in Assembly Services
Experience in Mechanical Design
Possibilities Offered by SECO
Heat dissipation solutions - both passive and active via a fan – also for the newest CPUs, with the aid of heat pipe systems where necessary.
Manufacturing of plastic components with injection molding
Production of aluminum mechanical parts with extrusion technology
Design of mechanical parts with die-casting technology
Bending and pressing of sheet metal parts
Development of personalized wiring to manage the connection of all parts of systems containing one or more boards/displays, etc.
Smart Edge Computing
Off-the-shelf solutions
Cloud-agnostic
Multi-protocol industrial Ethernet support
Ideal for Industrial IoT applications
System integration-ready solutions
Description

Thanks to our experience in integrating modules and boards into complex systems, SECO has created “off-the-shelf” solutions based on its own ARM and x86 SBCs, all available in our catalog. SECO Smart Edge Boxed Solutions have been developed for applications in Industrial IoT with the goal of satisfying the need for flexibility and security.

4 Items

per page
Set Descending Direction
  1. DORADO
    DORADO
    IP20 boxed PC based on Rockchip RK3399 Applications Processor
  2. PICTOR
    PICTOR
    Boxed solution based on Rockchip RK3399 Applications Processor
  3. DRACO (formerly codenamed SYS-D14-MED)
    DRACO (formerly codenamed SYS-D14-MED)
    Boxed Gateway for Medical applications with Intel® Atom™ x5-E3930 Processors
  4. CYGNUS (formerly codenamed SYS-B68-IPC)
    CYGNUS (formerly codenamed SYS-B68-IPC)
    Boxed solution with Intel® Atom™ X Series (formerly Apollo Lake) Processors

4 Items

per page
Set Descending Direction