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SECO’s wide range of products for the most innovative projects: Modules, Single-Board Computers, Fanless Embedded Computers, HMIs and solutions for Smart Edge Computing, as well as Carrier Boards, Starter Kits, and all the accessories to complete your project.

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  1. SOM-COMe-CT6-ASL
    SOM-COMe-CT6-ASL
    COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000E Series (Codename: Amston Lake and Alder Lake N)
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  2. SOM-COMe-BT6-MTL
    SOM-COMe-BT6-MTL
    COM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U)
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  3. ME03-DISS-1-PK
    ME03-DISS-1-PK
    Com-Exp - Raptor Lake Heat spreader (PASSIVE) - Packaged
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  4. ME03-DISS-3-PK
    ME03-DISS-3-PK
    Com-Exp - Raptor Lake Heat sink (ACTIVE) - Packaged
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  5. SBC-3.5-MX8
    SBC-3.5-MX8
    3.5" SBC with NXP i.MX8 Applications Processors. (THEMIS - C43)
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  6. SBC-3.5-MX8X
    SBC-3.5-MX8X
    3.5” SBC with NXP i.MX 8X Applications Processors. (VESTA - C57)
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  7. SBC-3.5-MX8M-Mini
    SBC-3.5-MX8M-Mini
    3.5” SBC with the NXP i.MX 8M Mini Processors. (ASTRID - C61)
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  8. SBC-3.5-TGL-UP3
    SBC-3.5-TGL-UP3
    SBC 3.5” with the 11th Gen Intel® Core™ and Intel® Celeron® (codename: Tiger Lake-UP3). (PRISMA - D64)
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  9. SBC-3.5-RK3568
    SBC-3.5-RK3568
    3.5” SBC with Rockchip RK3568 SoC. (SAYLOR - E09)
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  10. Carrier-Trizeps-pConXS
    Carrier-Trizeps-pConXS
    Carrier Board for Trizeps SODIMM SOMs
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  1. Ttl Uarts ≥2 Remove This Item
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Cpu Power Consumption
  1. range 10-25 W 8 item
  2. range < 10 W 13 item
  3. range < 5 W 3 item
  4. range > 25 W 8 item
Cpu Type
  1. AMD Ryzen™ Embedded R1000 1 item
  2. AMD® Ryzen™ embedded V-Series™ 2 item
  3. Intel® Atom™ 5 item
  4. Intel® Celeron® 6 item
  5. Intel® Core™  7 item
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  10. NXP i.MX 8M Nano 2 item
  11. NXP i.MX 8M Plus 1 item
  12. NXP i.MX 8X 2 item
  13. NXP i.MX6  3 item
  14. NXP i.MX8  1 item
  15. Rockchip RK3568 1 item
  16. Zynq® Ultrascale+™  1 item
Ethernet
  1. ETHERNET≥1 27 item
  2. ETHERNET≥2 9 item
Form Factor
  1. COM Express® 12 item
  2. Qseven 5 item
  3. Single Board Computer  5 item
  4. SMARC 4 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 3 item
  3. 48,5 x 32,5 mm 1 item
  4. 67,6 x 36,7 mm 2 item
  5. ≤ 100 x 100mm 15 item
  6. ≤ 80 x 80mm 9 item
  7. ≥ 100 x 100mm 6 item
Form Factor Specification
  1. 3,5" 5 item
  2. COM Express Basic 5 item
  3. COM Express Compact 7 item
  4. Qseven 70x70 mm 2 item
  5. µQseven 70x40 3 item
Mass Storage
  1. M.2 NVMe SSD slot 5 item
  2. M.2 SATA SSD slot 1 item
  3. microSD card slot  6 item
  4. onboard eMMC 20 item
  5. onboard SSD 1 item
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  7. SATA channels ≥ 2  12 item
  8. SATA channels ≥ 3 1 item
  9. SATA channels ≥ 4 1 item
  10. SD interface  11 item
Memory
  1. soldered down 13 item
  2. SO_DIMM 11 item
  3. ≤1 24 item
  4. ≤16 6 item
  5. ≤2 22 item
  6. ≤4 22 item
  7. ≤8 14 item
  8. ≥32 10 item
Operating Temperature
  1. -20°C ÷ +60°C 18 item
  2. -20°C ÷ +70°C 3 item
  3. -40°C ÷ +85°C 21 item
  4. 0°C ÷ +50°C 20 item
  5. 0°C ÷ +60°C 25 item
  6. 20°C ÷ +70°C 17 item
Pci Express
  1. PCI-e lanes ≥ 1 19 item
  2. PCI-e lanes ≥ 2 12 item
  3. PCI-e lanes ≥ 3 10 item
  4. PCI-e lanes ≥ 4 11 item
  5. PCI-e lanes ≥ 5 10 item
USB
  1. USB 2.0 ≥ 1  22 item
  2. USB 2.0 ≥ 2  22 item
  3. USB 2.0 ≥ 3 18 item
  4. USB 2.0 ≥ 4 16 item
  5. USB 2.0 ≥ 5 12 item
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  7. USB 3.0 ≥ 1 15 item
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  9. USB 3.0 ≥ 3 7 item
  10. USB 3.0 ≥ 4 7 item
  11. USB 3.1 ≥ 1 1 item
  12. USB 3.1 ≥ 2 1 item
  13. USB 3.2 ≥ 1 1 item
  14. USB 3.2 ≥ 2 2 item
  15. USB 4.0 ≥ 2 1 item
  16. USB OTG 11 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 2 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 2 item
  3. M.2 Socket 2 key B (SSD) 1 item
  4. ONBOARD WI-FI/BLE 8 item