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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module with Qualcomm® QCS5430 processor

Аппаратное обеспечение AI

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  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 3 items
  3. Intel® Core™ 7 items
  4. Intel® Pentium® 1 item
  5. Intel® Xeon® 1 item
  6. MediaTek Genio 510 1 item
  7. MediaTek Genio 700 1 item
  8. NXP i.MX 933/935 1 item
  9. NXP i.MX 95 1 item
  10. Qualcomm® QCS5430 1 item
  11. Qualcomm® QCS6490 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≤8 1 item
  5. soldered down 1 item
Mass Storage
  1. onboard eMMC 1 item
  2. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 1 item
  4. 20°C ÷ +70°C 1 item
  5. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 3.1 ≥ 1 1 item
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 1 item
  3. eDP 1 item
  4. MIPI-DSI 1 item