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Titan 300 TGL-UP3 AI
Основные моменты
GraphicsIntel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays
MemoryTwo DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory with IBECC
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
Откройте для себя приложения, совместимые с этим продуктом, доступные в SECO Application Hub: готовые решения для ускорения разработки и развертывания интеллектуальных функций.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
Описание
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Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS |
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CPU Description
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AI Chip: 100+ TOPS inference power - Voyager SDK for effortless deployment of AI applications |
Memory Description
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2x DDR4-3200 SODIMM slots |
Graphics Description
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Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities |
Video Interfaces Description
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2x Multimode DisplayPort 1.4, on dual DP++ connector |
Video Resolution Description
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DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC |
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Mass Storage Description
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On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB |
Networking Description
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2x 2.5 Gigabit Ethernet RJ45 connectors Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included*
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USB Description
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2x Superspeed USB 10Gbps ports on Dual Type-A sockets |
Audio Description
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Lineout + MicIn combo TRRS Audio Jack |
Serial Ports
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2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector |
Other Interfaces
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Optional 2x 12 poles terminal block connectors with the following I/O:
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Power Supply
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12VDC to 24VDC range, Mega-Fit 2p RA Connector |
Operating System
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Microsoft® Windows 10 IoT Enterprise LTSC 2021 |
Operating Temperature Description
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Commercial range: 0°C to +40°C, with 0.7m/s airflow**
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Dimensions
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199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives) |
Номер детали
Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS