SOM-COMe-BT6-RPL-P

Computer on Module (CoM) COM Express® 3.1 Type 6 Basic con processori Intel® Core™ di tredicesima generazione (Codename: Raptor Lake-P). (CALLISTO - E03)

Disponibile nell'intervallo di temperatura industriale

Data sheet

Supporto e Documentazione

Contattaci per maggiori informazioni e per preventivi

Contattaci

Cpu

13th Gen Intel® Core™ processors targeted for IoT Applications

Grafica

embedded Intel® Iris® Xe graphics with up to 96 execution units

Connettività

1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen 2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4.

Memoria

Two DDR5 SO-DIMM Slots supporting DDR5-4800 IBECC Memory, up to 64GB

Dettagli Prodotto

Informazioni tecniche

Descrizione	Computer on Module (CoM) COM Express® 3.1 Type 6 Basic con processori Intel® Core™ di tredicesima generazione (precedentemente noti come Raptor Lake-P)
Cpu	13th Gen Intel® Core™ processors (Raptor Lake U/P/H series) and Intel® Processor U300E: U series, up to 10C (2P+8E), up to 12M cache, 15W TDP P series, up to 14C (6P+8E), up to 24M cache, 28W TDP H series, up to 14C (6P+8E), up to 24M cache, 45W TDP
Memoria	Two DDR5 SO-DIMM slots supporting DDR5-4800, IBECC modules memory, up to 64GB
Grafica	Intel® UHD Graphics/Intel® Iris® Xe Graphics architecture, up to 96 EU Improved image (IPU6EP) and video processing (AV1/GNA 3.0) Support up to 4 independent displays @ 4K
Interfacce video	Up to 3x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1 1x VGA (factory option) 1x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface (factory alternatives)
Risoluzione video	HDMI and DP up to 8K @ 60Hz via TCSS with Hayden Bridge eDP 1.4b up to 5K @ 120Hz (HBR3 with VDSC1.1) LVDS up to 1920x1200 @ 60Hz
Memoria di massa	2x SATA Gen3 channels Up to 128 GB on-board NVMe SSD (factory alternative to one PCI-express Graphics (PEG) x4 Gen4)
Rete	1x NBase-T Ethernet interface with Intel® I225 GbE controller, with TSN and 2.5GbE supported.
USB	Up to 2x USB 4 Gen2 host ports (depending on carrier board retimer implementation) 4x USB 3.2 Gen2 (10Gbps) host ports (depending on carrier board retimer implementation) 8x USB 2.0 host ports
Pci	Up to 8x PCI-e x1 Gen3 lanes 1x PCI-express Graphics (PEG) x8 Gen4 Up to 2x PCI-express Graphics (PEG) x4 Gen4
Audio	HD audio and Soundwire/i2S audio interfaces
Porte seriali	2x UARTs
Altre interfacce	SPI, I2C, SM Bus, Thermal Management, FAN management Optional eSPI or LPC bus (factory alternatives) Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4 x GPI, 4 x GPO
Dispositivo di alimentazione	+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)
Sistema operativo	Microsoft® Windows 10 Linux Ubuntu
Temperatura operativa	0°C to +60°C (commercial version)* -40°C to +85°C (industrial version)* *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensioni	125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout)