SOM-COM-HPC-A-ARL

COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E87)

Data sheet

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Cpu

Intel® Core™ Ultra Processors (Series 2) Family

Grafica

Integrated Intel® Xe LPG+ graphic controller with up to 128 EU

Connettività

Up to 2x NBase-T 2.5GbE; Up to 2x USB 20Gbps + 2x USB 10Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen4.

Memoria

Two SO-DIMM slot supporting DDR5-6400 IBECC memory, up to 64GB

Dettagli Prodotto

Informazioni tecniche

Descrizione	COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors (series 2) Family (Codename: Arrow Lake -H and -U). (E87)
Cpu	Intel® Core™ Ultra Processors Family (Codename: Arrow Lake-H) • Intel® Core™ Ultra 9 processor 285H with vPRO, 6 P-Cores @2.5 GHz (turbo 5.4 GHz) + 8 E-Cores @1.9 GHz (turbo 4.5 GHz), 24M cache - 35/45/115W power: • Intel® Core™ Ultra 7 processor 265H, 6 P-Cores @1.2 GHz (turbo 5.4 GHz) + 8 E-Cores @0.9 GHz (turbo 4.5 GHz), 24M cache - 20/28/65W power: • Intel® Core™ Ultra 5 processor 235H with vPRO, 4 P-Cores @1.3 GHz (turbo 5.0 GHz) + 8 E-Cores @1.0 GHz (turbo 4.4 GHz), 18M cache - 20/28/65W power. Intel® Core™ Ultra Processors Family (Codename: Arrow Lake- U) - 12/15/28W Power: • Intel® Core™ Ultra 7 processor 265U with vPRO, 2 P-Cores @1.8 GHz (turbo 5.3 GHz) + 8 E-Cores @1.5 GHz (turbo 4.2 GHz), 12M cache • Intel® Core™ Ultra 5 processor 235U with vPRO, 2 P-Cores @1.6 GHz (turbo 4.9 GHz) + 8 E-Cores @1. GHz (turbo 4.1GHz), 12M cache
Memoria	Two DDR5 SO-DIMM slot supporting DDR5-6400 IBECC modules, up to 64GB (*) IBECC: In-Band Error-Correcting Code Memory
Grafica	Integrated Intel® Xe LPG+ graphics controller with up to 8 Xe cores (128 EU) Support up to 4 independent displays
Interfacce video	2 x Digital Display Interfaces (DDIs), supporting DP, HDMI, DP Alt-Mode over Type-C 1x DDI Interface supporting DP / HDMI / eDP 1 x eDP interface
Risoluzione video	HDMI®: DP 2.1: eDP 1.4b: up to 8K60 according to HDMI® 2.1 up to 8K60Hz / 5K120Hz up to 4K120Hz HDR
Memoria di massa	Up to 2x S-ATA Gen3.2 channels Optional NVMe SSD (PCIE-e x4 interface) soldered onboard, up to 1TB
Rete	Up to 2x NBase-T ethernet interfaces with Intel® I226 GbE controller, supporting 2.5GbE
USB	2x USB 10Gbps interfaces 2x USB 20Gbps/40Gbps interfaces 8x Hi-Speed USB ports
Pci	Up to 7x PCI-e x1 Gen4 lanes (4x groupable) Up to 3x PCI-e x4 Gen4 ports 1x PCI-e x8 Gen5 port (-H Series processors only) Max 9 root ports supported
Audio	HD audio interface 2x Soundwire interface
Porte seriali	2x 4-wires UARTs
Altre interfacce	Boot SPI + GP SPI, 2x I2C, SM Bus, thermal management, FAN management eSPI interface Optional TPM 1.2/2.0 on-board Power and system management signals Watchdog 12x GPIO 2x MIPI-CSI-2 4-lane camera interfaces
Dispositivo di alimentazione	+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)
Sistema operativo	Microsoft® Windows 10 IoT Enterprise 2019 LTSC Microsoft® Windows 10 IoT Enterprise 2021 LTSC Yocto Kirkstone
Temperatura operativa	0°C to +60°C (Commercial version)
Dimensioni	120 x 95 mm (COM-HPC® Size A Form factor, Client pinout)