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Computer on Module
COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)

Computer on Module

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  1. Form Factor Specification
    Qseven 70x70 mm
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Opzioni
Cpu Maker
  1. Intel 4 elementi
  2. NXP 3 elementi
Cpu Power Consumption
  1. range 10-25 W 3 elementi
  2. range < 10 W 7 elementi
Cpu Type
  1. Intel® Atom™ 4 elementi
  2. Intel® Celeron® 4 elementi
  3. Intel® Pentium® 2 elementi
  4. NXP i.MX 8M 1 elemento
  5. NXP i.MX6 1 elemento
  6. NXP i.MX8 1 elemento
Form Factor Dimensions
  1. ≤ 100 x 100mm 6 elementi
  2. ≤ 80 x 80mm 7 elementi
Form Factor Specification
  1. COM Express Basic 8 elementi
  2. COM Express Compact 13 elementi
  3. COM-HPC Client 4 elementi
  4. Qseven 70x70 mm 7 elementi
  5. µQseven 70x40 4 elementi
InstallationDepth
  1. memory ≤4 1 elemento
  2. memory ≤1 1 elemento
  3. memory ≤2 1 elemento
  4. soldered down 1 elemento
Memory
  1. memory ≤1 7 elementi
  2. memory ≤16 1 elemento
  3. memory ≤2 7 elementi
  4. memory ≤4 7 elementi
  5. memory ≤8 4 elementi
  6. soldered down 7 elementi
Mass Storage
  1. onboard SSD 2 elementi
  2. microSD card slot 2 elementi
  3. onboard eMMC 6 elementi
  4. SATA channels ≥ 1 5 elementi
  5. SATA channels ≥ 2 4 elementi
  6. SD interface 6 elementi
Operating Temperature
  1. -20°C ÷ +60°C 5 elementi
  2. -40°C ÷ +85°C 7 elementi
  3. 0°C ÷ +50°C 6 elementi
  4. 0°C ÷ +60°C 7 elementi
  5. 20°C ÷ +70°C 6 elementi
Pci Express
  1. PCI-e lanes ≥ 1 6 elementi
  2. PCI-e lanes ≥ 2 4 elementi
  3. PCI-e lanes ≥ 3 3 elementi
  4. PCI-e lanes ≥ 4 2 elementi
ScreenDimension
  1. TTL Uarts ≥1 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 6 elementi
  2. TTL Uarts ≥2 3 elementi
USB
  1. USB 2.0 ≥ 1 6 elementi
  2. USB 2.0 ≥ 2 6 elementi
  3. USB 2.0 ≥ 3 6 elementi
  4. USB 2.0 ≥ 4 6 elementi
  5. USB 2.0 ≥ 5 4 elementi
  6. USB 2.0 ≥ 6 4 elementi
  7. USB 3.0 ≥ 1 5 elementi
  8. USB 3.0 ≥ 2 1 elemento
  9. USB 3.2 ≥ 2 1 elemento
  10. USB OTG 3 elementi
Video Interfaces
  1. DP 4 elementi
  2. DP++ 2 elementi
  3. DUAL CHANNEL LVDS 6 elementi
  4. eDP 5 elementi
  5. HDMI 6 elementi
  6. MIPI-CSI camera conn 2 elementi
  7. SINGLE CHANNEL LVDS 6 elementi
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 elemento
  2. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 elemento
Computer on Module
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)