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TA61-DISS-1-PK

TA61-DISS-1-PK

ETX-A61 Heat Spreader (PASSIVE) Packaged

SD63-DISS-3-I-PK

SD63-DISS-3-I-PK

SBC-pITX-EHL Heat Sink (ACTIVE) for Atom x6xxxx CPUs - Packaged

SD63-DISS-3-C-PK

SD63-DISS-3-C-PK

SBC-pITX-EHL Heat Sink (ACTIVE) for Celeron/Pentium Nxxxx & Jxxxx CPUs - packaged

SD63-DISS-2-C-PK

SD63-DISS-2-C-PK

SBC-pITX-EHL Heat Sink (PASSIVE) for Celeron/Pentium Nxxxx & Jxxxx CPUs - Pakaged

SD63-DISS-1-C-PK

SD63-DISS-1-C-PK

SBC-pITX-EHL Heat Spreader (PASSIVE) for Celeron/Pentium Nxxxx & Jxxxx CPUs - Packaged

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Opzioni
Cpu Maker
  1. Intel 1 elemento
Cpu Power Consumption
  1. range > 25 W 1 elemento
Cpu Type
  1. Intel® Xeon® 1 elemento
Ethernet
  1. ETHERNET≥1 1 elemento
Form Factor
  1. COM-HPC® 1 elemento
Form Factor Specification
  1. COM-HPC Client 1 elemento
Operating Temperature
  1. -40°C ÷ +85°C 1 elemento
  2. 0°C ÷ +60°C 1 elemento
Pci Express
  1. PCI-e lanes ≥ 1 1 elemento
  2. PCI-e lanes ≥ 2 1 elemento
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 1 elemento
  5. PCI-e lanes ≥ 5 1 elemento
USB
  1. USB 2.0 ≥ 1 1 elemento
  2. USB 2.0 ≥ 2 1 elemento
  3. USB 2.0 ≥ 3 1 elemento
  4. USB 2.0 ≥ 4 1 elemento
  5. USB 2.0 ≥ 5 1 elemento
  6. USB 2.0 ≥ 6 1 elemento
Video Interfaces
  1. DP++ 1 elemento
  2. eDP 1 elemento
  3. HDMI 1 elemento