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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Computer embedded senza ventola basato sul processore Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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  1. Form Factor Dimensions
    ≤ 100 x 100mm
  2. Video Interfaces
    DP
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Opzioni
Cpu Maker
  1. AMD 2 elementi
  2. MediaTek 1 elemento
  3. NXP 2 elementi
  4. Qualcomm 3 elementi
Cpu Power Consumption
  1. range 10-25 W 2 elementi
  2. range < 10 W 3 elementi
  3. range > 25 W 1 elemento
Cpu Type
  1. AMD® Ryzen™ embedded 1 elemento
  2. MediaTek Genio 510 1 elemento
  3. NXP i.MX 8M 1 elemento
  4. NXP i.MX8 1 elemento
  5. Qualcomm® QCS5430 1 elemento
  6. Qualcomm® QCS6490 1 elemento
  7. Zynq® Ultras 1 elemento
  8. Qualcomm® Dragonwing IQ-8 1 elemento
Ethernet
  1. ETHERNET≥1 7 elementi
  2. ETHERNET≥2 4 elementi
Form Factor
  1. COM Express® 1 elemento
  2. Qseven 2 elementi
  3. SMARC 5 elementi
Form Factor Dimensions
  1. ≤ 100 x 100mm 8 elementi
  2. ≤ 80 x 80mm 3 elementi
  3. ≥ 100 x 100mm 1 elemento
Form Factor Specification
  1. COM Express Compact 1 elemento
  2. Qseven 70x70 mm 2 elementi
InstallationDepth
  1. memory ≤4 1 elemento
  2. memory ≤1 1 elemento
  3. memory ≤2 1 elemento
  4. soldered down 1 elemento
Memory
  1. memory ≤1 6 elementi
  2. memory ≤2 6 elementi
  3. memory ≤4 6 elementi
  4. memory ≤8 4 elementi
  5. memory ≥32 1 elemento
  6. soldered down 7 elementi
  7. SO_DIMM 1 elemento
  8. memory ≤32 1 elemento
Mass Storage
  1. microSD card slot 1 elemento
  2. onboard eMMC 4 elementi
  3. onboard eMMC 2 elementi
  4. SATA channels ≥ 1 2 elementi
  5. SATA channels ≥ 2 1 elemento
  6. SD interface 2 elementi
  7. SD interface 3 elementi
  8. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 6 elementi
  2. -20°C ÷ +70°C 1 elemento
  3. -40°C ÷ +85°C 5 elementi
  4. 0°C ÷ +50°C 6 elementi
  5. 0°C ÷ +60°C 8 elementi
  6. 20°C ÷ +70°C 6 elementi
  7. -20°C ÷ +70°C 2 elementi
Pci Express
  1. PCI-e lanes ≥ 1 5 elementi
  2. PCI-e lanes ≥ 2 4 elementi
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 2 elementi
  5. PCI-e lanes ≥ 5 1 elemento
ScreenDimension
  1. TTL Uarts ≥1 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 6 elementi
  2. TTL Uarts ≥2 6 elementi
  3. TTL Uarts ≥3 3 elementi
USB
  1. USB 2.0 ≥ 1 6 elementi
  2. USB 2.0 ≥ 2 6 elementi
  3. USB 2.0 ≥ 3 6 elementi
  4. USB 2.0 ≥ 4 5 elementi
  5. USB 2.0 ≥ 5 3 elementi
  6. USB 2.0 ≥ 6 1 elemento
  7. USB 3.0 ≥ 1 3 elementi
  8. USB 3.0 ≥ 2 2 elementi
  9. USB 3.0 ≥ 4 1 elemento
  10. USB 3.1 ≥ 1 3 elementi
  11. USB OTG 3 elementi
Video Interfaces
  1. DDI 1 elemento
  2. DP 8 elementi
  3. DUAL CHANNEL LVDS 13 elementi
  4. eDP 7 elementi
  5. HDMI 8 elementi
  6. MIPI-CSI camera conn 4 elementi
  7. MIPI-DSI 5 elementi
  8. SINGLE CHANNEL LVDS 10 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 elementi
  2. ONBOARD WI-FI/BLE 1 elemento
  3. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 elemento